The third stage of automatic wiring results in the realization of full-scale or partial automatic copper plating

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The third stage of automatic wiring results in the realization of full-scale or partial automatic copper plating [Copy link]

Program function: to realize full-scale or partial automatic copper plating.

The fully automatic copper plating program is the third stage result of the automatic wiring research. The first stage result is the short-line fully automatic wiring, and the second stage result is the full-board fully automatic or partial fully automatic vias. These two have been published and used before. These three programs can now be used together. The matching entrance is in Routing tools.

The program not only supports fully automatic copper plating for new board projects, but also supports fully automatic copper plating for revised board projects.

The program can automatically identify power signals and ground signals. It can automatically lay copper foil on the entire board for power signals, but not on the entire board for ground signals. It can automatically lay copper foil on parts of the board for ground signals.

The program can automatically chamfer the right angles of copper foil, and you can choose to chamfer a 45-degree angle or an arc.

Program Control Introduction

Set grid: Set the grid points for automatic copper plating. The purpose of setting the grid points is to facilitate manual adjustment of the copper plating size.

Add Outer LayerShape: Automatically add copper skin of TOP layer and BOTTOM layer to the whole page.

Miter: Select to make a 45 degree chamfer.

Arc: Select to perform arc chamfering.

Chamfer ShapeAll: Automatically chamfer the copper foil added by the program throughout the entire page.

Select Pin Shape: Perform partial copper plating on the selected pins. The user does not need to select the pins precisely. The software will analyze the pins selected by the user and automatically plating copper on the network with the largest number of pins.

Select Chamfer: Chamfer the selected copper skin, which may not be generated by the program. It does not support the chamfer of copper skin with void, so please note that.

Grid control: Displays a list of all copper foils automatically laid by the program. This list allows users to confirm whether the size of the copper foil laid by the program meets the design requirements one by one, and manually adjust the size of the copper foil if it does not meet the requirements. This work is usually done before copper foil chamfering.

Delete: Delete all copper skins generated by the automatic copper skinning program.

Close: Close the program.

? : View usage help and animated demonstrations.

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The tool is really good

In actual wiring, manual wiring of non-super-large circuits is labor-intensive or handled improperly, and automatic wiring is rarely used. People who use it are high-end circuit board design and wiring groups

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