How Qorvo implements 5G self-shielding technology
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5G has brought about major changes in the communications industry. The number of communication frequency bands has been in a state of rapid growth since the 4G era. Among them, the RF front end, as a core component of mobile phone communication functions, will directly benefit.
From discrete devices to FEMiD (Front-End Module with Integrated Duplexer) and then to PAMiD (Power Amplifier Module with integrated Duplexer), the trend of RF front-end integration is becoming more and more obvious.
Compared with FEMiD, PAMiD has a high degree of integration, which can save space on the PCB in mobile phones. Because it has many integrated modules, system design becomes easier to use. Qorvo has realized the transition from PAMiD to L-PAMiD (PA module with LNA) by integrating LNA (low noise amplifier) into PAMiD, which saves 35-40mm*2 area of RF front-end module, supports more functions, and makes PCB layout more reasonable.
In the RF front end, the generation of EMI (electromagnetic interference) and RFI (radio frequency interference) is a common problem, and as more and more components are integrated into the RF front end module, this phenomenon will become more common. At present, the industry generally uses an external mechanical shielding cover to shield the RF module, that is, embedded in a metal shell to protect the module from the influence of external electromagnetic fields. However, this practice may cause a decrease in sensitivity and an increase in harmonics, causing damage to the equipment and bringing many design risks.
To address the above issues, Qorvo developed a self-shielding module, which adds a layer of self-shielding metal coating on the surface of the module, which can reduce the surface current by 100 times. This is equivalent to its RF front-end module having a built-in shielding cover, and there is no need to worry about the placement of the mechanical shielding cover.
The launch of Qorvo's self-shielding module helps customers design mobile phone PCB modules without worrying about the mechanical shield causing unnecessary coupling in the L-PAMiD. Currently, this technology is mainly used in some high-end mobile phones such as Apple and Samsung.
Qorvo believes that the continued integration of RF front-end modules and the application of self-shielding modules will be an important development trend of RF front-end in the future. Although the cost of PAMiD is relatively high at present, with the rapid development of the 5G era, L-PAMiD using Qorvo's self-shielding technology will be accepted by more manufacturers and will be popularized in mid- and low-end mobile phones in the future.
From the PAMiD/L-PAMiD product roadmap shared by Qorvo, it can be seen that all of Qorvo's current products integrate self-shielding and LNA at the same time and support 5G frequency bands. Qorvo once stated at the earnings conference that in terms of the Fusion 20 product portfolio, its parts are universal and can be used with all 5G basebands on the market today, and customers can freely match modules according to their own needs.
The gallium nitride (GaN) process that Qorvo has been working on for many years has also shined in 5G construction. Qorvo's GaN power amplifier series used in 5G is very wide, which can support different frequencies and power levels of 5G to meet the needs of different customers. In this fiscal quarter, Qorvo's gallium nitride revenue doubled compared with the same period last year.
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