TI MSP430F55xx ultra-low-power MCUs enable smarter connectivity

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TI MSP430F55xx ultra-low-power MCUs enable smarter connectivity [Copy link]

As USB connectivity becomes more prevalent, designers are looking for intelligent embedded processing solutions that can bring many unique advantages to their applications, such as longer battery life, greater portability, and richer functionality. To provide easy-to-use advanced connectivity for robust and reliable products, Texas Instruments (TI) has introduced the new MSP430F55xx microprocessor (MCU) series with embedded full-speed USB2.0 (12 Mbps). The new F55xx series perfectly combines high-performance analog and other intelligent integrated peripherals to achieve world-leading ultra-low power consumption. The F55xx MCU does not require a power cord, making it ideal for low-cost applications including consumer electronics, portable measurements for healthcare and industry, and many other application areas.

Key features and benefits of the MSP430F55xx

· 5 low-power modes, including 200 uA/MHz operating current, 2.5 uA in standby mode, and less than 5 milliseconds wake-up time in standby mode, achieving the lowest power consumption in the industry and significantly extending battery life;

A wider range of flash storage from 8KB to 128KB, providing an easy migration path;

High-performance analog, including 10-bit or 12-bit ADC options that consume less than 200uA in active mode, and sub-microamp ultra-low power comparators for a wide range of applications;

Integrated intelligent peripherals, including hardware multiplier, four 16-bit timers, and up to four serial communication interfaces (such as UART, SPI, and I2C);

A variety of small package options, such as 48-pin QFP and QFN packages, 64-pin QFN packages, and 80-pin QFP and BGA packages;

Fully integrated LDO can be powered directly from the 5V bus supply, saving both cost and board space;

Broad USB portfolio with more than 35 device options, delivering greater peripheral and analog integration, expanded memory and packaging options, and multiple low-cost alternatives.