What is the packaging of integrated circuits? What are the common types of packaging? What are their respective characteristics?

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What is the packaging of integrated circuits? What are the common types of packaging? What are their respective characteristics? [Copy link]

1. What is the package of integrated circuits?

The so-called package refers to the shell used to install semiconductor integrated circuit chips. It not only plays the role of placing, fixing, sealing, protecting chips and enhancing thermal conductivity, but also serves as a bridge between the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role in CPU and other LSI (Large Scale Integration) integrated circuits. The emergence of a new generation of CPUs is often accompanied by the use of new packaging forms. The chip packaging technology has gone through several generations of changes, from DIP, QFP, PGA, BGA to CSP, and then to MCM. The technical indicators are more advanced than the previous generation, including the ratio of chip area to package area is getting closer to 1, the applicable frequency is getting higher and higher, the temperature resistance is getting better, the number of pins is increasing, the pin spacing is reduced, the weight is reduced, the reliability is improved, and it is more convenient to use.

2. What are the common types of integrated circuit packaging?

Common types of integrated circuit packaging include: DIP dual in-line package, PQFP component package, MSOP micro small outline package, PGPGA pin grid format, CSP chip size and MCM multi-chip module.

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3. What is DIP dual in-line package? What are its characteristics?

DIP (Dual In-line Package) refers to integrated circuit chips packaged in dual in-line form. Most medium and small scale integrated circuits (ICs) use this package form, and the number of pins is generally not more than 100. The CPU chip using DIP package has two rows of pins and must be inserted into a chip socket with a DIP structure. Of course, it can also be directly inserted into a circuit board with the same number of solder holes and geometric arrangement for soldering. Be especially careful when inserting and removing DIP packaged chips from the chip socket. DIP package has the following characteristics.

(1) Suitable for perforating and soldering on PCB, easy to operate.

(2) The ratio between the package area and the chip area is large, so the volume is also large.

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4. What are PQFP component packaging and PFP packaging? What are their characteristics?

The distance between the chip pins of the PQFP (Plastic Quad Flat Package) component packaging is very small, and the pins are very thin. Generally, large-scale or ultra-large integrated circuits use this packaging form, and the number of pins is generally more than 100. Chips packaged in this form must use SMD (surface mount device technology) to solder the chip to the motherboard. Chips installed using SMD do not need to punch holes on the motherboard, and generally there are designed solder joints for the corresponding pins on the surface of the motherboard. Align the pins of the chip with the corresponding solder joints to achieve welding with the motherboard. The chip welded in this way is difficult to remove without special tools.

PFP (Plastic Flat Package) packaging is basically the same as PQFP. The only difference is that PQFP is generally square, while PFP can be either square or rectangular.

PQFP and PFP packaging have the following characteristics.

（1）Suitable for SMD surface mounting technology to install wiring on PCB circuit boards.

（2）Suitable for high frequency use.

（3）Easy to operate and high reliability.

（4）The ratio between chip area and package area is small.

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5. What is MSOP?

MSOP (Miniature Small Outline Package) is a packaging form of electronic components, that is, a surface mount component packaging form with wing-shaped or J-shaped short leads on both sides.

The MSOP micro small outline package is widely used in the packaging of integrated circuits with 8 pins, 10 pins, 12 pins and up to 16 pins. The distance between two adjacent pins of the MSOP micro-small outline package is only 0.5mm, which is different from the SOP (Small Outline Package). The small outline package is a very common component form, one of the surface mount packages, and the pins are led out from both sides of the package in a seagull wing shape (L shape). The materials are plastic and ceramic, and it began in the late 1970s.

SOP package has a wide range of applications, and later gradually derived SOJ package (J-type pin small outline package), TSOP package (thin small outline package), VSOP package (very small outline package), SSOP package (shrink SOP), TSSOP package (thin shrink SOP)

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6. What is PGA pin grid integrated circuit package? What are its characteristics? PGA (Pin Grid Array Package) chip package has multiple square-shaped pins inside and outside the chip, and each square-shaped pin is arranged at a certain distance around the chip. Depending on the number of pins, it can be surrounded by 2 to 5 circles. When installing, insert the chip into a special PGA socket. In order to make it easier to install and remove the CPU, starting from the 486 chip, a CPU socket called ZIF appeared, which is specially used to meet the requirements of PGA packaged CPUs in installation and removal. What is the package of integrated circuits? What are the common types of packages? What are their characteristics? ZIF (Zero Insertion Force Socket) refers to a socket with zero insertion and extraction force. By gently lifting the wrench on this socket, the CPU can be easily and easily inserted into the socket. Then press the wrench back to its original position, and use the squeezing force generated by the special structure of the socket itself to firmly contact the CPU pins with the socket, and there will be absolutely no problem of poor contact. To remove the CPU chip, just lift the wrench of the socket slightly, the pressure will be released, and the CPU chip can be easily removed. PGA pin grid packaging has the following characteristics. (1) The plug-in and pull-out operation is more convenient and the reliability is high. (2) It can adapt to higher frequencies.

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7. What is BGA ball grid array integrated circuit packaging? What are its characteristics?

With the development of integrated circuit technology, the requirements for integrated circuit packaging are more stringent. This is because packaging technology is related to the functionality and performance of the product. When the frequency of the IC exceeds 100MHz, the traditional packaging method may produce the so-called "CrossTalk" phenomenon, and when the number of IC pins is greater than 208Pin, the traditional packaging method has its difficulties. Therefore, in addition to using QFP packaging, most of today's high-pin-count chips (such as graphics chips and chipsets) have switched to BGA (Ball Grid Array Package) packaging technology. As soon as BGA appeared, it became the best choice for high-density, high-performance, multi-pin packaging such as CPUs and north/south bridge chips on motherboards.

BGA packaging technology can be divided into the following five categories. (1) PBGA (Plastic BGA) substrate: a multilayer board generally made of 2 to 4 layers of organic materials. Among the Intel series CPUs, Pentium II, III, and IV processors all use this packaging form. (2) CBGA (Ceramic BGA) substrate: a ceramic substrate. The electrical connection between the chip and the substrate is usually installed by flip chip (FC). In the Intel series CPU, Pentium I, Pentium II, and Pentium Pro processors have all adopted this packaging form. (3) FCBGA (Filp Chip BGA) substrate: a hard multi-layer substrate. (4) TBGA (Tape BGA) substrate: a soft 1-2 layer PCB circuit board in the form of a strip. (5) CDPBGA (Carity Down PBGA) substrate: refers to the chip area (also known as the cavity area) with a square depression in the center of the package. (b) BGA (Ball Grid Array Package) packaging has the following characteristics.

(1) Although the number of I/O pins increases, the distance between the pins is much larger than that of QFP packaging, which improves the yield rate.

(2) Although the power consumption of BBGA increases, the controlled collapse chip method is used for welding, which can improve the electrothermal performance.

（3）The signal transmission delay is small and the adaptability frequency is greatly improved.

（4）Coplanar welding can be used for assembly, which greatly improves reliability.

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8. What is CSP chip size integrated circuit packaging? What are its characteristics?

As the global electronic products are becoming more personalized and lightweight, the packaging technology has advanced to CSP (Chip Size Package). It reduces the size of the chip package shape, and achieves the same size as the bare chip. That is, the side length of the packaged IC size is no more than 1.2 times that of the chip, and the IC area is only no more than 1.4 times larger than the die.

CSP packaging can be divided into the following four categories.

(1) Lead Frame Type (traditional lead frame type): Representative manufacturers include Fujitsu, Hitachi, Rohm, Goldstar and other companies.

(2) Rigid Interposer Type (rigid interposer type): Representative manufacturers include Motorola, Sony, Toshiba, Panasonic and other companies. (3) Flexible Interposer Type: The most famous is Tessera’s microBGA. CTS’s sim-BGA also uses the same principle. Other representative manufacturers include General Electric (GE) and NEC. (4) Wafer Level Package: Different from the traditional single chip packaging method, WLCSP is a wafer-level package that cuts the entire wafer into individual chips. It is known as the future mainstream packaging technology. Manufacturers that have invested in research and development include FCT, Aptos, Casio, EPIC, Fujitsu, Mitsubishi Electronics and other companies.

The characteristics of CSP packaging are as follows.

(1) It can meet the needs of the ever-increasing number of chip I/O pins. (2) The ratio between chip area and package area is very small. (3) Greatly shorten the delay time.

CSP packaging is suitable for ICs with a small number of pins, such as memory sticks and portable electronic products. In the future, it will be widely used in emerging products such as information appliances (IA), digital televisions (DTV), e-books (E-Books), wireless networks WLAN/GigabitEthemet, ADSL/mobile phone chips, Bluetooth, etc.

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9. What is MCM multi-chip module integrated circuit packaging? What are its characteristics?

In order to solve the problem of low integration and imperfect functions of a single chip, multiple high-integration, high-performance and high-reliability chips are combined into a variety of electronic module systems on a high-density multi-layer interconnection substrate using SMD technology, thus giving rise to the MCM (Multi Chip Module) multi-chip module system.

The features of MCM multi-chip module integrated circuit packaging are as follows:

1. The packaging delay time is shortened, making it easy to realize high-speed module.

2. Reduce the packaging size and weight of the whole machine/module.

3. The reliability of the system is greatly improved.