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Can a multi-layer board via be made without some solder rings? [Copy link]

When designing/producing multi-layer PCBs, the process specifies the minimum solder ring width of vias. But if the via only passes through a certain layer without any electrical connection, is this solder ring necessary? Because of the existence of the solder ring, the diameter of the circle dug out on the copper of that layer will be larger.

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If a layer is not connected, it is not necessary to design a through hole. The board manufacturer will process each layer according to Gerber. However, the blind hole and buried hole need to design the hole attributes. The attributes should contain solder rings.  Details Published on 2018-10-9 15:04
 

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It must be there, otherwise how can the PCB manufacturer provide copper for the vias?
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If a layer is not connected, it is not necessary to design a through hole. The board manufacturer will process each layer according to Gerber. However, the blind hole and buried hole need to design the hole attributes. The attributes should contain solder rings.
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The process can be done this way, but the design will be troublesome, and different versions of vias with the same aperture need to be designed. Next time I will make a four-layer board to test it.  Details Published on 2018-10-9 15:51
 
 
 

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qwqwqw2088 posted on 2018-10-9 15:04 If a layer is not connected, it is not necessary to design and draw through holes. The board factory will process each layer according to Gerber, but the blind and buried holes need to design the hole properties...
The process can be done this way, but the design will be troublesome. Different versions of through holes with the same aperture must be designed. Next time I will make a four-layer board to test it.
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