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Location:Training / Circuit Fundamentals / Mechanics in Electronic Packaging / Material issues in high-reliability lead-free soldering (Part 2)

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Material issues in high-reliability lead-free soldering (Part 2)
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Duration：19 minutes and 6 seconds
Date：2019/06/29

Uploader：木犯001号

Introduction

keywords： Electronic Packaging Mechanics

Modeling, simulation and cutting mechanics analysis in precision machining (Lecturer: Professor Cheng Kai)
Mechanical issues in electronic packaging (Lecturer: Professor Liu Sheng)
Surface and interface physical mechanics in nano-micro systems - experiments, cross-scale Simulation and theoretical modeling (Lecturer: Researcher Zhao Yapu)
Basic theories and methods of optimal design of advanced lightweight structures (Lecturer: Professor Zhang Weihong)
From "forming" processing to surface integrity and fatigue-resistant manufacturing (Lecturer: Professor Zhang Dinghua)
Micro Scale plastic mechanics and cross-scale correlation (Lecturer: Professor Li Zhenhuan)

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