Jintuo shares: has developed several semiconductor-specific equipment, mainly benchmarking some equipment manufacturers in the United States, Japan and other countries

On May 19, Jintuo Co., Ltd. responded to investors' inquiries about "whether the company's silicon wafer equipment is exclusive in China" on the investor interaction platform, stating that the company is committed to tackling some semiconductor equipment in the packaging and testing links and silicon wafer manufacturing links that have technical barriers and domestic gaps. It has currently developed several special semiconductor equipment, which are mainly benchmarked against some chip packaging equipment and silicon wafer manufacturing equipment manufacturers in the United States, Japan, Germany and Singapore.

Jintuo shares also pointed out that domestic semiconductor packaging and silicon wafer manufacturing equipment are the company's strategic businesses. The company is committed to continuously tackling some semiconductor equipment with technical barriers and domestic gaps in the packaging and testing links and silicon wafer manufacturing links, while broadening the application areas of semiconductor equipment, such as IGBT, IC substrates, Wafer Bumping, Clip Bonding, FC BGA and other production and manufacturing fields, in the hope that the revenue from semiconductor-specific equipment will become an incremental part of the company's performance.

It is worth mentioning that Jintuo's entry into the semiconductor field is based on the company's optimism about the long-term trend of the domestic semiconductor industry. However, along with high expected returns, the semiconductor industry also has the characteristics of high investment risks and long payback cycles. In line with the attitude of being responsible to the company's shareholders, the company conducted a survey of the industrial chain and finally chose to enter the semiconductor industry chain with special equipment, relying on the company's more than 20 years of technical accumulation and precipitation in the field of electronic manufacturing special equipment, and thus fully utilizing the company's advantages in technology research and development, iteration, etc.

Therefore, Jintuo's current business is positioned to provide domestically produced special equipment for the semiconductor industry. There is no plan to set up a subsidiary to produce chips, but the company will continue to pay attention to the development trends of the domestic semiconductor industry and adjust the company's strategies in related fields in a timely manner.

Jintuo shares previously stated that the semiconductor industry is an important foundation of the electronic information industry and a strategic industry that the country encourages to develop. The state and governments at all levels have also issued a series of encouraging policies to support the development of semiconductors and semiconductor equipment manufacturing, creating a good policy environment. Semiconductor equipment has the characteristics of high technical content and high equipment value. The company's research and development and market development of domestic semiconductor equipment have all been expensed in the early stage of related materials, technology, personnel, funds, etc. The company has already entered the market with a number of semiconductor-specific equipment.

Semiconductor equipment refers to the production equipment needed to produce various types of semiconductor products. It is a key supporting link in the semiconductor industry chain and is mainly used in the two processes of integrated circuit manufacturing and packaging and testing. It includes front-end process equipment, back-end process equipment and other equipment. The front-end process equipment is wafer processing equipment, and the back-end process equipment includes testing equipment and packaging equipment. Other equipment includes silicon wafer growth equipment, etc.

It is understood that currently Jintuo Co., Ltd.'s semiconductor-specific equipment includes semiconductor thermal equipment and semiconductor silicon wafer manufacturing equipment. Semiconductor thermal equipment refers to semiconductor equipment that uses heat treatment technology in the semiconductor manufacturing and packaging and testing processes. Currently, the company's semiconductor thermal equipment is mainly used in the packaging and testing process, and semiconductor silicon wafer manufacturing equipment is mainly used in the production and manufacturing process of semiconductor silicon wafers.