Tianyu Semiconductor builds 8-inch silicon carbide epitaxial wafer production line in Dongguan, plans to start construction this year

On April 13, the Management Committee of Dongguan Songshan Lake High-tech Industrial Development Zone conducted a pre-approval announcement of the "Dongguan Eco-Park 2022 Land Acquisition and Development Plan" (hereinafter referred to as the "Plan").

The plan shows that Dongguan plans to expropriate 6.316 hectares of land, which will be used to ensure the implementation of the semiconductor project of Dongguan Tianyu Semiconductor Technology Co., Ltd.

In addition, the "Plan" shows that Tianyu Semiconductor is the first national high-tech enterprise in China that specializes in the research and development, design, manufacturing and sales of third-generation wide-bandgap semiconductor silicon carbide (SiC) epitaxial wafers, and has been working in Songshan Lake for more than 10 years. The company's main domestic customers include: Zhuzhou CRRC, State Grid, US X-FAB, China Resources Microelectronics, Tyco Tianrun, Shanghai Jetta, Hong Kong APS, BYD and other internationally renowned companies, as well as dozens of well-known domestic universities, research institutes and design companies; overseas chip customers are also gradually expanding, including: Japan's Hitachi and Rohm, the United States Texas Instruments (X-Fab) and Germany's Infineon.

The core product of this project is SiC epitaxial wafers, and Tianyu Semiconductor will use this project to further consolidate its industrial foundation. The project plans to purchase 94.7 acres of land to build Tianyu Semiconductor's silicon carbide epitaxial material research and development and industrialization project, which will be used for the research and development of key silicon carbide epitaxial technologies and the construction of the world's first 8-inch silicon carbide epitaxial wafer production line.

The main contents of the project are to build a 6-inch/8-inch silicon carbide epitaxial wafer production line with an additional capacity of 1 million pieces/year; research and development of key technologies for the industrialization of 8-inch silicon carbide epitaxial wafers; and production and sales of 6-inch/8-inch silicon carbide epitaxial wafers. The project is scheduled to start construction in 2022 and is expected to be completed and put into production in 2025.