According to foreign media reports, Graphcore, a British chip design company, recently released its intelligent processor (IPU) product, which uses TSMC's Wafer-on-Wafer advanced packaging technology. It is said to be the first time that this technology has been commercialized.
The company said that by bonding 7-nanometer process chips "wafer-to-wafer", the processor performance was increased by 40% and the energy efficiency was improved by 16% within the same package area, achieving a computing performance of 89 PetaFlops.
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Recommended ReadingLatest update time:2024-11-17 06:37
Intel, Samsung, and TSMC, the three giants compete for advanced technology
Moore's Law has driven the semiconductor industry forward. Previously, it relied on two magic weapons: one was the reduction of process size, and the other was the increase of silicon wafer diameter. Obviously, the reduction of process size was the main factor, because the size of silicon wafers has not moved to 18 in
[Semiconductor design/manufacturing]
Jiangsu Huacun is indeed working on 12nm SSD controller, using TSMC process
Earlier, there was news that Jiangsu Huacun Electronic Technology Co., Ltd. is working on 12nm SSD master control. This news was recently confirmed by Jiangsu Huacun General Manager Wei Zhifan. According to IC Coffee, Wei Zhifan said in an interview that Jiangsu Huacun team is also gathering elite R&D personnel to wor
[Mobile phone portable]
US media: TSMC’s business in China receives another “one-year exemption” from the US
According to a report on the US "Wall Street Journal" website on October 12, the United States has notified Asia's three major chip manufacturers, including TSMC, that they can continue to maintain their current operations in mainland China for the foreseeable future, but major technology upgrades may There are diffic
[Semiconductor design/manufacturing]
Qualcomm gets TSMC's 6nm process capacity, may take back the market
On May 8, according to blogger @手机陶瓷达人, Qualcomm is ready to come back. The reason why it did not make efforts in the first half of the year was that it suffered from shortages. However, in the third quarter, Qualcomm obtained the production capacity of TSMC's 6nm process and will start "super-large quantities" of waf
[Mobile phone portable]
TSMC plans to build its first advanced packaging and testing plant in Japan
Taiwanese media revealed that at the strong invitation of the Japanese Ministry of Economy, Trade and Industry, TSMC plans to set up an advanced packaging and testing plant in Tokyo, Japan. According to reports, the two parties will set up a joint venture to operate the plant, with each party contributing half of th
[Semiconductor design/manufacturing]
Why can TSMC's revenue reach a new high amid the chip shortage?
On April 15, TSMC, the world's largest chip foundry that manufactures chips for Apple, AMD and many other manufacturers, released its first-quarter financial report. Its revenue met expectations and set a new record, and its net profit was close to US$5 billion, a significant year-on-year increase. However, while th
[Semiconductor design/manufacturing]
Japan invites TSMC to help revive its semiconductor industry, but success or failure is still uncertain
Core Viewpoint──focuses on major domestic and international industry events, gathers the views of Chinese and foreign celebrities and experts, analyzes industry development trends, and helps you understand future trends! According to Jiwei.com, Japan has long wished to introduce TSMC. In March this year, TSMC establis
[Mobile phone portable]
TSMC said: This year's profit focus is on 7nm
TSMC, the leading foundry company, announced that its revenue in April was NT$74.694 billion, down 6.3% from the previous month and 8.8% from the previous year. Its revenue in the first four months was NT$293.398 billion, down 11.1% from the previous year. According to TSMC's second quarter revenue forecast, industry
[Mobile phone portable]
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