Bioncore Technology announced the completion of approximately RMB 100 million in angel round financing, committed to building a new generation of EDA platform company

In January 2022, Bioncore Technology completed an angel round of financing of nearly 100 million yuan. Following the previous investments of Inno Angel, Fosun Capital, and Lingang Technology, Oriza Puhua, a well-known domestic integrated circuit investment institution, joined the investment. This round of financing is mainly used to upgrade the high-precision and large-capacity simulation platform from digital circuits to analog and RF circuits, as well as the digital-analog hybrid sign-off platform. The products have been sold to leading customers.

Founded in 2020 by serial entrepreneurs in the EDA and AI fields, Bioncore Technology is committed to building a new generation of EDA platform companies. The company's core business is large-capacity, high-precision chip simulation and sign-off based on distributed computing, as well as high-performance interconnect and high-performance computing IP. Target customers cover three major areas: chip design, manufacturing, and packaging.

According to Bionchip Technology, the company's main products include BTDSim and BTDesign, which are mainly aimed at post-Moore chip design, including high-speed/radio frequency (RF) chip simulation and optimization, as well as multi-physics (including signal and power integrity) simulation and verification of chips and advanced packaging (high-density PCB, 3D/2.5D multi-chip integration and core-grain integration).

Chen Datong, Chairman of Yuanhe Puhua Investment Committee, said that EDA is an indispensable part of the semiconductor industry, and with the changes in the international situation, there is a strong demand for domestic EDA software. The Bioncore team has rich industry experience and we are very happy to work with such an excellent team. We believe that as the team continues to launch new products, Bioncore will become an excellent platform-based EDA company.