According to Nikkei, Toshiba will invest approximately 100 billion yen (US$873 million) to build a new power semiconductor production line in Japan, which is expected to start production in March 2025.
Toshiba aims to meet growing demand for power chips used in automobiles, servers and industrial equipment. All production equipment will be compatible with 300mm wafers, and a 300mm production line will be added at Kaga Toshiba Electronics, which will double Toshiba's power chip output.
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