Zhuhai Yuexin project started construction and is expected to be ready for production in July next year

On December 8, the groundbreaking ceremony for Zhuhai Yuexin Semiconductor Co., Ltd.'s high-end RF and FCBGA packaging substrate production and manufacturing project (hereinafter referred to as the "Zhuhai Yuexin Project") was held in Zhuhai Fushan Industrial Park, marking the official start of Zhuhai Yueya Semiconductor Co., Ltd.'s 3.5 billion capital increase project.

It is reported that Zhuhai Yuexin Semiconductor Co., Ltd., which leads the project, is a wholly-owned subsidiary of Zhuhai Yueya Semiconductor Co., Ltd. The Zhuhai Yuexin project includes two large plots of land with a total area of ​​88,000 square meters, and Yueya's 3.5 billion capital increase project has officially settled here. The project will expand the production and manufacturing projects of high-end RF and FCBGA packaging substrates, further expand the production scale of high-end RF and FCBGA packaging substrates, and form industrial synergy with Yueya's existing products. The project is expected to be ready for production in July 2022; after production, the company's annual output value is expected to reach 8 billion yuan, and its production capacity will increase by 3 times.