Produced by TSMC, the world's leading wafer foundry, Inventec Corporation is the first to use Montara for its Hyun Yin flagship TR-X TWS in-ear headphones
Beijing, China - October 12, 2021 - xMEMS Labs announced today that the world's first single-chip MEMS speaker, Montara, is now in production. Thanks to close cooperation with TSMC, the world's leading semiconductor foundry partner, Montara has passed all performance and reliability verifications. Inventec Corporation (IAC) also announced that its own brand Chiline will be the first to use Montara to create a high-performance, more powerful TWS (true wireless Bluetooth) in-ear headset for its new flagship product.
Inventec's TR-X is the world's first true wireless Bluetooth headset to use the xMEMS Montara single-chip MEMS speaker and Aptos piezoelectric audio driver IC. Montara helps TR-X deliver stunning spatial audio performance and a new level of mid/high-frequency clarity and presence. From March 2022, consumers will be able to purchase the new TR-X headset online.
xMEMS' Montara is the world's first single-chip MEMS speaker, using silicon chips to realize both the driver and the diaphragm, achieving unparalleled levels of frequency response and phase consistency of each component. Montara's fast mechanical response results in the industry's lowest group delay and phase shift. For manufacturers, these features can reduce calibration and speaker pairing. The thinness of only 1 mm, SMT-ready packaging and IP58 dust/waterproofing can simplify system design, integration and assembly. Montara meets IEC (International Electrotechnical Commission) and the more stringent JEDEC (Solid State Technology Association) standards to improve quality and reliability. Consumers will benefit from a stunning spatial audio experience and enjoy a higher level of music clarity and detail, and waterproof headphones.
“We are pleased to have TSMC as a strategic foundry partner and value the collaboration to commercialize our TRUE MEMS speakers and their advanced MEMS (micro-electromechanical systems) technology,” said Zhengyao Jiang, co-founder and CEO of xMEMS. “We are also grateful to Inventec for being a key manufacturing partner and for their foresight in identifying MEMS as the future of speakers. We look forward to working with many OEM partners to establish successful designs for the new era of speakers.”
“TSMC is pleased to see the results of our close collaboration with xMEMS to deliver the world’s first single-chip speaker using our MEMS technology,” said Dr. Paul Rousseau, senior director of TSMC’s North American Field Technology Solutions Division. “TSMC has a long history of working with industry innovators to expand the use of MEMS, from traditional motion sensing to microphones, biosensing, micro speakers, and medical ultrasonic actuators. We remain committed to developing more advanced MEMS technologies to enable customers to create new products for new applications and bring product innovations to market quickly.”
“Inventec is a key manufacturing partner for many TWS headset innovators, and we are proud to be an early adopter of new technologies, such as MEMS speakers, that keep us ahead of the curve,” said Daishui He, General Manager of Inventec. “Starting with the TR-X, we are creating novel hearable products with unique and superior sound quality to meet current and future spatial audio applications, while leveraging xMEMS’ technology to advance our manufacturing capabilities.”
About xMEMS Labs
Founded in January 2018, xMEMS Labs is reinventing sound with the world's first single-chip True MEMS speaker for TWS and other personal audio devices. xMEMS has 34 patents and more than 100 patents pending. The company is committed to designing advanced solutions and applications for a wide range of consumer electronic devices using MEMS technology.
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