Chengxinwei received 50 million yuan in Series B financing and is preparing for A-share listing?

Recently, Shenzhen Chengxinwei Technology Co., Ltd. (hereinafter referred to as Chengxinwei) completed a RMB 50 million Series B financing. Investors include Donghai Investment Control, CITIC Construction Investment, Times Bole, etc.

According to official news from Chengxinwei, this round of financing will be used to focus on core technology R&D investment, market promotion and accelerated team building. The funds will be mainly used in the following three aspects: increase R&D investment in automotive-grade power management chips to promote the company's product upgrades and technology iterations; deploy brushless motor drive chips, smart homes and IoT terminals to develop cost-effective power chips; continue to improve and build a more professional and efficient talent team, and improve business segments.

Founded in 2009, Chengxinwei is committed to the development of core chips in the fields of automotive power management, consumer power supply, brushless motor drive, etc. It is headquartered in Shenzhen, China, and has established R&D centers in Chengdu, Wuxi, Hefei and other places.

Chengxinwei already has product lines including BUCK circuit power chips, switching power chips, synchronous rectification chips, fast charging protocol chips, medium and low voltage MOS, personal care product integrated chips, etc. Its products are widely used in many fields such as automotive electronics, portable electronics, small household appliances, new energy vehicles, etc.

It is reported that since its establishment, Chengxinwei has established strategic partnerships with hundreds of well-known domestic and foreign companies such as Xiaomi, Philips, ANKER, BYD, CE-LINK, Gree, and Feike. In addition, Chengxinwei's official news shows that the company is currently preparing for an A-share listing.