Deep Technology: Hefei Payton Storage Phase I Project Tops Out

On the morning of June 26, the topping-out ceremony of the first phase project of Hefei Payton Storage Technology Co., Ltd. was successfully held.

It is understood that after reaching an investment agreement with the Hefei Municipal Government, Shenzhen Technology, together with the National Integrated Circuit Industry Investment Fund Phase II, Hefei Industrial Investment, and China Electronics PolyCore, registered and established Hefei Payton Storage Technology Co., Ltd. on October 30, 2020. With the joint efforts of all parties, the project achieved the interim results of successfully topping out the first phase of the project in less than 4 months.

According to Shenzhen Technology News, in order to cope with changes in the international market environment and actively respond to the national development strategy, Shenzhen Technology has stepped up its efforts to deploy strategic emerging industries such as integrated circuit packaging and testing, forming a "3+1" development model that focuses on the development of storage semiconductors, independent products, high-end manufacturing fields, and the key construction of Shenzhen Technology City projects, striving to achieve transformation and upgrading of its business operations.

Zhou Jian, Chairman of Shenzhen Technology, said in his speech that after the completion of this project, it will greatly improve my country's memory industry chain, form a strong competition with international giants, and break my country's memory field's dependence on imported products. This project will focus on national strategic needs, actively undertake the packaging and testing business of national memory strategic projects, promote key breakthroughs and overall improvement of my country's memory industry, achieve leapfrog development, and provide strong support for the transformation of economic development mode and the improvement of comprehensive national strength.

At the same time, Hefei Payton Memory will also fill an important link in Hefei's semiconductor industry chain, and cooperate with leading companies in Hefei's two major industry chains of IC design and IC manufacturing to jointly contribute to the construction and improvement of the "chip-screen-auto integration, lifelong intelligence" industrial system.

Zhou Jian emphasized that in recent years, my country's integrated circuit industry has developed rapidly and its overall strength has been significantly improved, but integrated circuit products are still heavily dependent on imports. The key equipment and some materials required for memory chip manufacturing and packaging and testing are still holding us back. Deep Technology's goal is not only to cooperate with customers to build Payton into the largest packaging and testing company in China and even the world, but more importantly, it hopes to provide its own experience and assistance to customers and upstream and downstream companies, break through foreign blockades, and establish a completely independent and controllable integrated circuit industry chain.

It is reported that the Hefei Peiton storage project covers an area of ​​about 178 acres, with one-time planning and phased construction. Construction started in March 2021. According to the construction plan, the project will complete all construction tasks by the end of September this year, and move into production equipment in early October, striving to achieve production and effective production capacity by the end of this year. After the project reaches full production, it is expected to achieve an annual production capacity of 576 million DRAM particles, 38.4 million NAND FLASH packages, and 30 million memory modules, and is expected to achieve an annual revenue of about 2.8 billion yuan.