Diversification of integrated circuit applications will be the main challenge facing packaging integration

According to Jiwei.com, on January 8, 2021, the 2020 Investor Annual Meeting of Xiamen Semiconductor Investment Group Co., Ltd. and the Xiamen (Haicang) Integrated Circuit Enterprise Advanced Packaging Seminar were successfully held in Haicang, Xiamen.

At the meeting, Yu Daquan, general manager of Xiamen Yuntian Semiconductor Technology Co., Ltd., delivered a speech entitled "Embracing the New Era of Advanced Packaging". Yu Daquan said that the diversification of integrated circuit applications will be the main challenge facing packaging integration.

Yu Daquan pointed out that in the new era of advanced packaging, there are several major development trends:

1. High-density TSV technology/Fan-Out technology has become the core technology of advanced packaging due to its flexibility, high density and suitability for system integration.

2. Advanced packaging is becoming an increasingly important means to continue and expand Moore's Law

3. Advanced packaging has evolved from mid-range technology to front-end technology, and line width accuracy has moved towards sub-micron. Advanced technology is dominated by TSMC, Samsung, and INTEL

4. Advanced packaging is increasingly moving towards chip stacking and interconnection, providing a technical foundation for chiplet development

5. Packaging and testing companies have broad space in the field of advanced packaging. After the front-end packaging integration, the subsequent packaging also needs the support of packaging and testing companies.

6. Advanced packaging places higher demands on equipment technology and materials: high-precision and high-speed C2W is very important

7. 5G high speed and high frequency pose new challenges to packaging integration

8. Heterogeneous integration and microsystem integration are becoming more difficult and bring new challenges

9. Collaborative innovation is needed

Yu Daquan said that international giants including TSMC, Xilinx, Intel, and Samsung are all investing in TSV technology. At the same time, more and more CPUs, GPUs, and memories are beginning to apply TVS technology. On the one hand, TSV technology is constantly maturing, and on the other hand, this is inseparable from the huge demand for high-performance computing and artificial intelligence.

Yu Daquan also pointed out that with the diversification of integrated circuit applications, emerging fields have put forward higher requirements for advanced packaging, and packaging technology has developed rapidly. At present, advanced packaging has become an increasingly important means to continue and expand Moore's Law. Advanced packaging has evolved from mid-channel technology to front-channel technology, and line width accuracy has moved towards sub-micron. 5G high speed and high frequency have brought new challenges to packaging integration, and heterogeneous integration and microsystem integration have brought even more difficult new challenges.

Yuntian Semiconductor was established in July 2018. The company is committed to 5G RF device packaging and integration technology. Its main businesses include filter wafer-level 3D packaging, high-frequency millimeter-wave chip integration, RF module integration, IPD passive device design and manufacturing, and Bumping/WLCSP/TGV technology, providing customers with full-process R&D solutions and services from product collaborative design, process research and development to mass production.

Yuntian Semiconductor's Phase I factory is located in Haicang District, Xiamen, with a construction area of ​​4,500 square meters. It has a 4-inch and 6-inch WLP production capacity of 8,000 pieces per month and has now entered mass production; the Phase II 24,000 square meter factory is currently under construction and is expected to be put into use in Q2 2021. By then, the company will have a full range of wafer-level packaging capabilities from 4-inch, 6-inch to 8-inch and 12-inch.

Yu Daquan said that Yuntian Semiconductor takes 5G RF as a breakthrough point, provides system integration and packaging solutions, and helps customers seize 5G. With the model of "special process + advanced packaging + solution", it explores the industrialization of advanced packaging technology in the new era. It has made a series of breakthroughs in RF front-end devices, filter packaging, modules, IPD, chip and antenna integration, and hopes to make its due contribution to China's core.