Nantong Yueya Semiconductor Phase I project completed and received first customer certification

According to Founder Group, Nantong Yueya Semiconductor has successfully completed trial production recently, received its first customer certification, and has completed the full-process qualification review.

As the largest high-tech industrial project since the establishment of Gangzha District in Nantong City, Nantong Yueya Semiconductor has a planned total investment of approximately RMB 3.77 billion. Currently, the first phase of the project has been completed.

According to Founder Group, Yueya is the world's first company to use the "copper pillar build-up method" to achieve mass production of "coreless" packaging substrates. Its main products are packaging substrates and chip-embedded packaging substrates used in 3G/4G/5G wireless RF power amplifiers and their front-end modules, baseband chips and microprocessor chips. Yueya's core technology has obtained more than 70 authorized invention patents in China, the United States, South Korea, Israel and other countries, and more than 100 world patents are under application.

In April this year, the first batch of equipment for the Nantong Yueya Semiconductor Project entered the factory for debugging. According to the Nantong Daily at the time, the project was scheduled to be put into production before the end of June.

The Nantong Yueya Semiconductor Project is located in Nantong Science and Industry Park. The contract was signed on May 9, 2018, and the groundbreaking ceremony was held on August 28, 2018. The total investment of the project is about 3.77 billion yuan. After completion, it can reach an annual output of 3.5 million semiconductor modules, semiconductor devices, and packaging substrates.