Xiaomi Mi 9 Pro 5G official disassembly: double-stacked motherboard placed inside 5G module-EEWORLD

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Jiwei.com (Text/Kelven) Xiaomi officially released two 5G mobile phones, Xiaomi 9 Pro and Xiaomi MIX Alpha, at the end of September. Among them, Xiaomi 9 Pro 5G has been on the market. It has made minor adjustments to the appearance and re-stacked internal components based on the ID basic design of Xiaomi 9. It is worth mentioning that Xiaomi 9 Pro is currently the cheapest 5G mobile phone.

Xiaomi Mi 9 Pro 5G is equipped with a Qualcomm Snapdragon 855 Plus processor with a 7nm process technology, a 6.39-inch AMOLED water drop screen with a resolution of 2340 x 1080, a built-in 4000mAh battery, and up to 12GB of memory and 512GB of storage. It uses an L-shaped large-size VC heat sink liquid cooling to reduce the CPU core temperature by 10.2°C.

Xiaomi Mobile officially released the official disassembly pictures of the Xiaomi 9 Pro 5G mobile phone, where we can see the internal chip structure, cooling module, charging module and other components.

The picture above shows a 30W custom wireless charging coil, with a large area of heat dissipation graphite covered on the back that is connected in series with the motherboard; the edge of the camera is sealed with foam to enhance the airtightness of the phone.

48MP Sony main camera + 12MP portrait + 16MP ultra-wide angle, front 20MP beauty selfie camera.

In order to meet the needs of 5G, the Xiaomi 9 Pro 5G motherboard adopts a double-layer stacking design and adds a new 5G baseband and RF chip.

Xiaomi Mi 9 Pro uses a 10x10x3.5 horizontal linear motor, which, with the support of a dedicated high-voltage driver chip, can achieve a starting and braking time of 10ms.

Reference address：Xiaomi Mi 9 Pro 5G official disassembly: double-stacked motherboard placed inside 5G module

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