The report examines the key components of smartphones, revealing how much a phone costs and the industry position of each component supplier.
Here are the highlights of the report:
- 4G deployment is slow, with operators' network upgrades set to continue until 2016, with 3G remaining the dominant technology until then.
-This year or next, 3G device sales will exceed 1 billion units.
-Apple dominates the mobile phone manufacturing industry, while Qualcomm leads the mobile phone component market.
-By 2015, Apple will have 40% of the smartphone market.
Figure 2: Cost of smartphone components. The touch screen costs $11 to $13, and the GPS costs $1 to $2.
Figure 3: Cost of smartphone components: Camera module costs $9 to $10, battery costs $5 to $6
Figure 4: Mobile semiconductor market situation
Figure 5: In 2011, Qualcomm accounted for 24% of the mobile semiconductor market share, while Intel only accounted for 6%
Figure 6: Smartphone shipments from 2008 to 2011. Apple and Samsung both surpassed Nokia in 2011.
Figure 7: In 2011, Apple and Samsung both accounted for 19% of the smartphone market share, and Nokia accounted for 18%
Figure 8: Average selling prices of major mobile phone manufacturers in 2011, with Apple having the highest
Figure 9: Operating profit margins of major mobile phone manufacturers in 2011, with Apple also having the highest
Figure 10: Smartphone shipments in different regions from 2007 to 2013 (forecast), with Asia Pacific leading the way
Figure 11: Mobile phone shipments by technology from 2009 to 2016 (forecast), 3G mobile phones gradually dominate
Figure 12: 3G mobile phone shipments by technology from 2009 to 2016 (forecast), with HSPA being the most popular technology
Figure 13: Mobile phone shipments of different mobile operating systems from 2008 to 2011. Android phones are becoming more and more popular.
Previous article:Qualcomm adjusts structure and creates new subsidiary to protect technology patents
Next article:Qualcomm CEO: We do not rule out the possibility of building our own chip factory
Recommended ReadingLatest update time:2024-11-17 00:44
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Send a few photos to celebrate the New Year
- [ART-Pi Review] 2: Onboard Storage QSPI_FLASH
- [STM32F769Discovery development board trial] Single bus DHT11 driver & ADC light/proximity sensor & serial driver RGB
- A more complete 3D package diagram
- 【STM32WB55 Review】_02_Experience the power of ultra-low power consumption
- [Solved] How is the opencv library of dsp generated in the official data of DM8148
- Radar system basic design
- Integrated Circuit Design: How to Become an IC Design Expert
- Characteristics and quality judgment of communication switching power supply
- Bluetooth low energy dimmable smart lighting solution