Qualcomm Introduces New Features of Snapdragon X70 Modem-RF System

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Smart Transmit 3.0 introduces support for cellular, Wi-Fi and Bluetooth for enhanced, robust and reliable connectivity


Terminals equipped with Snapdragon X70 achieve the world's first 5G millimeter wave independent network connection


SAN DIEGO, May 10, 2022 – Qualcomm Technologies, Inc. today announced at the Qualcomm 5G Summit that the Snapdragon® X70 5G Modem-RF System supports new features and achieves new milestones. These achievements build on the fifth-generation modem-to-antenna 5G solution announced at MWC Barcelona in February this year. The Snapdragon X70 uses AI capabilities to achieve breakthrough 5G performance, including 10Gbps 5G download speeds, extremely fast upload speeds, low latency, excellent network coverage and energy efficiency, giving global 5G operators ultimate flexibility to fully utilize spectrum resources to provide the best 5G connectivity. The Snapdragon X70 uses advanced features such as the Qualcomm® 5G AI Suite, Qualcomm® 5G Ultra-Low Latency Suite, third-generation Qualcomm® 5G PowerSave, uplink carrier aggregation, mmWave standalone networking, and Sub-6GHz four-carrier aggregation to achieve unparalleled 5G performance.


The Snapdragon X70 scalable architecture supports new features and enables new achievements including:


Qualcomm® Smart Transmit™ 3.0 Technology: A system-level upgrade feature licensed from Qualcomm Technologies, Inc., now extends support for Wi-Fi and Bluetooth transmit power management. This feature implements real-time transmit power averaging for multiple wireless communications such as 2G to 5G, mmWave, Wi-Fi (2.4GHz 6/6E/7) and Bluetooth (2.4), resulting in superior RF performance.


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Smart Transmit 3.0 expands 5G network coverage, improves uplink speeds, and optimizes transmissions from cellular, Wi-Fi, and Bluetooth antennas. Smart Transmit 3.0 helps devices intelligently manage transmission power, allowing users to enjoy faster and more reliable connections.


The world's first 5G mmWave standalone connection, achieving peak speeds of more than 8Gbps: This milestone was achieved at Qualcomm Technologies' 5G Integration and Test Lab in San Diego based on Keysight's 5G Protocol Development Toolkit and a 5G test terminal powered by Snapdragon X70. 5G mmWave standalone networking supports the deployment of 5G mmWave networks and terminals without using Sub-6GHz spectrum anchors, which gives operators more flexibility to provide multi-gigabit speeds and ultra-low latency wireless fiber broadband access to personal and commercial users. Through this product demonstration, Qualcomm Technologies demonstrated its commitment to bringing new and best-in-class 5G enhancements to terminals and networks.


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“Snapdragon X70 gives operators the ability to deliver extreme 5G capacity, multi-gigabit data speeds and new use cases across a wide range of devices, including smartphones, laptops, fixed wireless access equipment and industrial machinery,” said Dejia Maddja, senior vice president and general manager of cellular modem and infrastructure business at Qualcomm Technologies. “We look forward to working with industry leaders to bring the best 5G connectivity experience to the intelligent connected edge and drive industry change in consumer, enterprise and industrial scenarios.”


During the Qualcomm 5G Summit , the company also demonstrated other features supported by the Snapdragon X70, such as AI-enhanced 5G performance and 5G Sub-6GHz carrier aggregation across three TDD channels (achieving peak download speeds of up to 6Gbps). 5G carrier aggregation can support higher average speeds and more robust connections in challenging environments, such as cell edges far away from cellular base stations.


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Snapdragon X70 is currently sampling to customers. Commercial mobile devices powered by Snapdragon X70 are expected to be available in late 2022. For technical details, visit the Snapdragon X70 webpage.


Keywords:Qualcomm Reference address:Qualcomm Introduces New Features of Snapdragon X70 Modem-RF System

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