At the 2019 Anchuang Future Technology Innovation "Chip" Conference, Huang Qing, Managing Director of Walden International China, said that China's semiconductor industry has gone through continuous learning from the "incubation" stage of cheap substitution to now entering a stage of focusing on increasing added value, strengthening research and development, introducing new functions, and cooperating with first-line customers.
Huang Qing pointed out that after decades of technological accumulation, a large number of successful semiconductor companies have emerged in China. This shows that for China's semiconductor industry, "it takes ten years to sit on the bench" and only after a long period of accumulation and endurance can it achieve success.
As the world's largest semiconductor market, China will continue to lead the market and create new value using innovative technologies in this industry in the future.
However, Huang Qing said that in the past few years, as the number of Chinese IC design companies increased, domestic companies also continued to differentiate, which eventually led to the dispersion of talents and resources in the entire industry. According to Huang Qing, from 2010 to 2018, the number of Chinese IC design companies increased from 582 to 1,698, and there were 632 Chinese chip design companies, but 87% of them had less than 100 employees.
Huang Qing said that in the future, my country's semiconductor companies will compete with international companies through scale wars. The key lies in the fact that companies must turn management capabilities into core capabilities. On the one hand, they should establish an effective hierarchical management model to achieve efficient management capabilities; then, through integration means such as mergers and acquisitions, they can expand the company's scale, improve competitiveness and accelerate development; and finally, they can use cooperation with customers and platforms to centrally integrate and allocate resources.
Previous article:The first public demonstration of a robot hand that can transmit tactile sensations, integrating the technologies of the three companies
Next article:US Senate: Actions against Huawei involve "national security"
Recommended ReadingLatest update time:2024-11-16 13:58
- Popular Resources
- Popular amplifiers
- Introduction to Internet of Things Engineering 2nd Edition (Gongyi Wu)
- Modern Electronic Technology Training Course (Edited by Yao Youfeng)
- Instrument Circuit Design and Application (Hao Xiaojian, Yang Shuping, Zhang Lianhong, etc.)
- China\'s Integrated Circuit and Optoelectronic Chip Development Strategy 2035
- Huawei's Strategic Department Director Gai Gang: The cumulative installed base of open source Euler operating system exceeds 10 million sets
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- Sn-doped CuO nanostructure-based ethanol gas sensor for real-time drunk driving detection in vehicles
- Design considerations for automotive battery wiring harness
- Do you know all the various motors commonly used in automotive electronics?
- What are the functions of the Internet of Vehicles? What are the uses and benefits of the Internet of Vehicles?
- Power Inverter - A critical safety system for electric vehicles
- Analysis of the information security mechanism of AUTOSAR, the automotive embedded software framework
Professor at Beihang University, dedicated to promoting microcontrollers and embedded systems for over 20 years.
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Confusion about TFT LCD interface
- What is the function of TI DSP GEL file?
- EEWORLD University ---- stm32f407 video tutorial
- How to use DSP software waiting?
- CCS compilation error: Solution for missing header file
- The eight major losses of switching power supplies are described in great detail!
- Regarding the timing issues and acquisition issues of AD chip ADS1251
- Power analyzer directly connected to CAN network
- RISCV Linux simulation environment construction and summary
- Introducing the TI C2000 stack evaluation method