Infineon Technologies Launches 650V CoolMOS™ CFD7A for Energy-Efficient Electric Vehicle Fast Charging

[Munich, Germany, November 27, 2023] The accelerated transition to electric vehicles has driven important innovations in automotive charging systems, which increasingly requires more cost-effective, high-performance power electronics . To this end, Infineon Technologies AG has launched the QDPAK package to further expand its 650 V CoolMOS™ CFD7A product lineup. Compared with the TO247 THD devices known to the industry, the product series with QDPAK package has the same heat dissipation capabilities, but higher electrical performance, enabling efficient energy utilization in on-board chargers and DC-DC converters.

650 V CooMOS CFD7A

Efficient and powerful electric vehicle charging systems help reduce charging time, reduce vehicle weight, increase design flexibility and reduce the total cost of vehicle ownership. This new product series has multiple functions and advantages through top and bottom cooling packages, which is an effective complement to the existing CoolMOS CFD7A product series. The QDPAK TSC (top cooling) package enables designers to achieve higher power density and better PCB space utilization.

The 650 V CoolMOS CFD7A offers several important features that support reliable operation in high-voltage applications . Due to reduced parasitic inductance, the device can minimize electromagnetic interference (EMI), ensuring clear signals and stable performance. The Kelvin source pin improves the accuracy of current sensing and ensures accurate measurements even under harsh conditions. With creepage distances suitable for high-voltage applications, high current capability and high power dissipation (Ptot) capabilities up to 694 W at 25°C temperature environment, the device is a powerful general-purpose device suitable for a variety of high-voltage applications.

New system designs using the 650 V CoolMOS CFD7A device in the QDPAK TSC package will maximize PCB space utilization, double the power density, and enhance thermal management through board-level decoupling. This approach simplifies assembly, avoids board stacking, and reduces the need for connectors, thereby reducing system costs. The power switch can reduce thermal resistance by up to 35%, providing better high power dissipation capabilities than standard cooling solutions.

This feature overcomes the thermal limitations of using FR4 PCB in bottom-cooled SMD designs and significantly improves system performance. The optimized power loop design places the driver close to the power switch, improving reliability by reducing stray inductance and chip temperature. Together, these features help build a cost-effective, robust, and efficient system that is well suited to modern charging needs.

As announced in February 2023, the QDPAK TSC package for high-power applications has been registered as a JEDEC standard, promoting the widespread adoption of TSC packaging in new designs through a unified standard package design and footprint. To further accelerate this transformation, Infineon will also release more automotive-grade devices using QDPAK TSC packages for on-board chargers and DC-DC converters in 2024, such as 750 V CoolSiC™ devices and 1200 V CoolSiC™ devices.

Availability

The 650 V CoolMOS CFD7A device is available in two versions, the QDPAK package, with top-side cooling (TSC) and bottom-side cooling (BSC). Both versions are available for order now.