The "Domestic Automotive Chip Reliability Classification Catalog" will be released at the 10th Automotive Electronics Innovation Conference!

To promote the connection between supply and demand of automotive chips, the "Reliability Classification Catalog of Domestic Automotive Chips" will be released at the 10th Automotive Electronics Innovation Conference!

Unlike consumer-grade products, automobiles will run in harsh environments such as outdoor, high temperature, high cold, and humidity. Their design life is generally 15 years or 200,000 kilometers, and the iteration cycle is much higher than the 2-3 years of consumer electronics. It has a negative impact on the environment and Vibration, shock, reliability and consistency requirements are very high. Car companies usually require suppliers to use automotive grade components to ensure the quality and reliability of automotive ECU products. As one of the "stepping stones" for automotive chips to enter the supply chain of car companies, AEC-Q100 is a quality standard developed by the American Automotive Electronics Council (AEC). It aims to ensure the reliability and safety of automotive electronic parts and ensure that the chip can withstand Extreme temperature, humidity, vibration and aging tests in automotive application environments are mainly used to prevent products from various situations or potential failure states and guide component suppliers to use chips that meet specifications during the development process.

In order to assist vehicle companies and parts manufacturers to quickly grasp domestic car-grade chip product information and AEC-Q100 passing status, and promote the construction of supporting systems and ecological chains for the automotive electronics industry, China Integrated Circuit Design Innovation Alliance, China Electronics Technology Standardization Institute, Shanghai Society of Automotive Engineers, China Society of Automotive Engineers Modernization Management Branch, and "China Integrated Circuit" magazine jointly launched the "Domestic Automotive Chip Reliability Classification Catalog (2023)" (hereinafter referred to as the "Catalogue"), which will be on July 13- A major announcement was made at the "10th Automotive Electronics Innovation Conference (AEIF 2023)" held in Wuxi on the 14th.

The "Domestic Automotive Chip Reliability Classification Catalog (2023)" currently has 228 products from 77 automotive chip companies included in the catalog, of which 62 companies have submitted 158 AEC-Q test reports. In addition, companies that are undergoing AEC-Q test certification and have AEC-Q test plans have also provided corresponding test plan sheets and other supporting materials. The selected automotive chip companies will be invited to participate in the "Automotive Semiconductor Industry Supply and Demand Matchmaking Conference" and participate in the docking with some domestic car companies, parts and Tier1 manufacturers.

The key product information in the "Catalogue" includes the maximum power consumption of the chip, included NVM capacity, packaging information, functions and application fields, main technical indicators, benchmark product models, and application status (in how many models it has been installed/rear-installed, as shown above) How many cars are there in total), AEC-Q passed test items, etc., covering power management chips, processors/MCUs, memories, information security chips, network interconnection chips, audio and video chips, infotainment chips, power devices, MEMS sensor device (motion/temperature/pressure), image sensor, ETC chip, NFC chip, interface chip, LED driver chip, IGBT, FPGA, wheel speed/speed/position sensor, analog-to-digital converter (ADC), signal chain/ More than 20 categories of automotive electronic chip products including operational amplifiers and gate driver chips.

As one of the important highlights of the "10th Automotive Electronics Innovation Conference (AEIF 2023)", Chen Dawei, one of the editorial board members of the "Catalogue" and deputy chief engineer of the China Electronics Technology Standardization Institute, will give a speech on the "Domestic Vehicle Regulations" at the meeting. "Chip Reliability Classification Catalog (2023)" will be released and interpreted. At that time, guests attending the meeting will get a glimpse of domestic automobiles by understanding the information and application status of domestic automotive grade products selected in the "Catalogue" and the completion of the AEC-Q reliability test project. The current status of automotive-level reliability certification of chip companies.

AEIF 2023 has the theme of "Integrated Innovation, Reconstructing the Automotive Electronics Industry Chain" . The complete agenda has been officially released, coming from the National New Energy Vehicle Technology Innovation Center, United Automotive Electronics Co., Ltd., China Electronics Technology Standardization Institute, and Shanghai Automotive Chip Engineering Center, Tongji University and other scientific research institutes, as well as Bosch, Geely, Shanghai Huizhong Automobile, Black Sesame, Shanghai HiSilicon, Renesas Electronics, BGI, Qipuwei, ADI, Xinchi, Keysight Technology, OmniVision Group , Jiefa Technology, Xinwang Micro, Kangzhi Integrated Circuit, Xinlit, Fudan Micro, ZTE Micro, Suzhou Guoxin Technology, Lingxin, Seripu, Xinqing Technology, Feixian Intelligent, InBev Supercomputing, Xiaohua Semiconductor, Hejian, Ruicheng Micro, Xingxing Technology, Zhongke Saifei, proteanTecs, Cadence, Hejian, Siemens EDA, VeriSilicon, Amkor Technology and other IC upstream and downstream industry chain enterprises, parts and vehicle manufacturers Technical experts will gather at AEIF 2023 to discuss cutting-edge technologies and trends related to automotive electronics.

Since its inception in 2013, AEIF has been successfully held for nine times and has now become one of the largest and most influential industry events in the automotive electronics industry. Relying on the resource integration advantages of the Automotive Modernization Management Branch of the China Society of Automotive Engineers, China Integrated Circuit Design Innovation Alliance, China Automotive Chip Industry Innovation Strategic Alliance, and Shanghai Society of Automotive Engineers, the conference specially invites complete vehicle and Tier 1, automotive electronic chip companies to jointly display Future development and product layout will create a deep integration platform for automotive and ICT technologies from chips, modules, components, Internet, software, system integration, to vehicle applications. The audience covers vehicles, components, semiconductors, chips, sensors, millimeters It covers radar, test and measurement, system software, vehicle terminals, Internet, information security, artificial intelligence, research institutes, investment institutions and many other fields, with a total of more than 6,000 professional visitors.