Panasonic Electric proposes "MIPTEC" packaging technology for medical capsule cameras

At the "Medical Technology Expo" held at Tokyo Big Sight from June 22 to 24, 2011, Panasonic Electric proposed that its "MIPTEC" packaging technology be used in medical capsule cameras such as capsule endoscopes. MIPTEC combines technology for forming circuits on the surface of injection molded products and laser patterning technology. The characteristic is that it can achieve "substrate-free" products because it can three-dimensionally form fine circuit patterns on the casing and package components (the company).

Medical capsule cameras such as capsule endoscopes need to package a variety of components in a small capsule. Therefore, in the past, flexible substrates were often bent into complex shapes for packaging. Panasonic Electric pointed out that this has problems in terms of assembly and packaging reliability. Panasonic Electric said that by

using MIPTEC to form fine circuits on the surface layer inside the capsule-shaped casing, the above problems can be solved. Since a flexible substrate is not required, assembly and packaging reliability are improved, and the casing serves as a reference for the packaging position, it is also easy to determine the position of optical components. According to Panasonic Electric, this is also conducive to reducing the size of the equipment.

Panasonic Electric's demonstration showed that not only medical capsule cameras, but also hearing aids can produce the same effect by using MIPTEC. Panasonic Electric will strongly recommend the use of MIPTEC in these medical devices.

Exhibition Board