The first expert group meeting of the 2019 TI Cup National Undergraduate Electronic Design Competition was successfully held at the International Education Exchange Center of Beijing Institute of Technology. Academician Wang Yue, academician of the Chinese Academy of Sciences and the Chinese Academy of Engineering, honorary president of Beijing Institute of Technology, Academician Guan Xiaohong, academician of the Chinese Academy of Sciences, executive director of the National Undergraduate Electronic Design Competition Organizing Committee and leader of the expert group, Mr. Le Daqiao, director of marketing communications for the Asia Pacific region of Texas Instruments (TI), Dr. Wang Chengning, director of the Asia Pacific University Program of TI, and members of the new National Undergraduate Electronic Design Competition expert group attended the expert group meeting. The convening of this meeting not only marks the full launch of the 2019 TI Cup National Undergraduate Electronic Design Competition, but also opens a new blueprint for the cooperation between the TI University Program and the new competition organizing committee in the next ten years.
The first expert group meeting of the 2019 TI Cup National Undergraduate Electronic Design Competition
The National Undergraduate Electronic Design Competition is one of the undergraduate subject competitions jointly initiated by the Department of Higher Education of the Ministry of Education and the Department of Personnel Education of the Ministry of Industry and Information Technology. It is a mass science and technology activity for college students, aiming to promote the reform of the curriculum system and course content of information and electronic disciplines in colleges and universities. After more than 20 years of development, the National Undergraduate Electronic Design Competition has become China's largest, most widely participated, and most influential electronic design competition for undergraduates, with more than 40,000 college students signing up to participate every year. In 2016, Texas Instruments (TI) and the Ministry of Education of China signed the third round of a ten-year strategic cooperation memorandum, which includes full support for the undergraduate electronic design competition advocated by the Ministry of Education in the next ten years, and helps college students enhance their innovation awareness and design capabilities by providing funds, software and hardware development tools, experimental boards and samples, technical training, and professional engineer guidance. Since then, TI has officially become the only sponsor of the National Undergraduate Electronic Design Competition from 2018 to 2027.
Academician Wang Yue said at the meeting: "Under close communication with the competition organizing committee, the 2019 TI Cup National Undergraduate Electronic Design Competition has received attention and support from the Department of Higher Education of the Ministry of Education and the Department of Personnel Education of the Ministry of Industry and Information Technology. Through cooperation with TI, the future National Undergraduate Electronic Design Competition will become more and more open, and the types of competition questions will become more and more diverse. In terms of proposition, we will continue to combine with cutting-edge industries and technologies such as 'Internet +' to fit the focus of education training. At the same time, this will also provide more flexibility in topic selection for many students who actively participate in the competition to ensure that their interests and expertise can be fully exerted and released in the competition. The National Undergraduate Electronic Design Competition will adhere to the overall spirit of 'experts as the leader and students as the main body' and continue to develop with the joint participation of students, teachers and experts."
Academician Wang Yue, academician of the Chinese Academy of Sciences and the Chinese Academy of Engineering, and honorary president of Beijing Institute of Technology, delivered a speech
As the executive director of the new National Undergraduate Electronic Design Competition Organizing Committee and the head of the expert group, Academician Guan Xiaohong introduced the future work guidelines on behalf of the expert group. He said: "After more than 20 years of practice and accumulation, the National Undergraduate Electronic Design Competition has retained very good traditions while continuing to develop. The new competition organizing committee and expert group will keep pace with the times while adhering to the purpose of the competition, so that the latest international cutting-edge technologies and major national needs can be reflected in the competition, especially the information science and technology, the fourth industrial revolution and the energy revolution that have developed rapidly in recent years. We will also maintain close communication and cooperation with TI and continue to serve the teachers and students of universities."
Academician Guan Xiaohong, Academician of the Chinese Academy of Sciences, Executive Director of the National Undergraduate Electronic Design Competition Organizing Committee and Head of the Expert Group
Speech
In addition to providing basic support such as funding, devices and training guidance, TI Asia Pacific Marketing Communications Director Le Daqiao also shared more exciting news at the conference. He said: "In order to encourage the active participation of college students and provide them with a platform and opportunity to expand their international horizons, TI will invite a team that won the highest award of the TI Cup in the 2019 National College Student Electronic Design Competition to visit TI's headquarters in Dallas, Texas, the United States, to go deep into the world's leading semiconductor design and manufacturing company to experience the most advanced products and cutting-edge innovative technologies. In addition, TI will also organize the winning teams to visit well-known higher education institutions in the field of electronic engineering in the United States, and invite relevant experts and professors to have in-depth discussions and exchanges with visiting students. For students and teams that perform well in the competition, TI will also provide them with additional internship opportunities to help them combine learning with practice and lay a solid foundation for future research or work."
TI Asia Pacific Marketing Communications Director Le Daqiao introduced TI's support for the National College Student Electronic Design Competition
In the subsequent agenda, Dr. Wang Chengning, Director of TI Asia Pacific University Program, introduced: "In the past ten years, TI has won the affirmation and recognition of many participating students and teachers by providing innovative products and technologies for provincial leagues. The full launch of the 2019 TI Cup National College Student Electronic Design Competition represents another important step in the development of TI's university program in China. It is also a dazzling milestone in the long history of cooperation between TI and the competition organizing committee. In the future, we will continue to maintain close cooperation with the competition organizing committee and the expert group, and spare no effort to provide more comprehensive support for the competition. In addition, we also hope to rely on the National College Student Electronic Design Training Network, with the support of the Ministry of Education's Industry-University Cooperation and Collaborative Education Project, to bring together the resources of TI, universities and the entire ecosystem to create a comprehensive and professional online learning platform for all participating students and even all students majoring in electronic engineering."
Dr. Wang Chengning, Director of TI Asia Pacific University Program, summarized and looked forward to the National Undergraduate Electronic Design Competition
2019 marks the 23rd year of the successful implementation of TI's university program in China. As a world-leading semiconductor company, TI has always made every effort to promote the university program in China. Under the premise of giving full play to TI's technological advantages, it helps the industry cultivate more professionals who master the world's advanced technologies through this cradle of innovation. In addition to supporting student competitions, TI has established more than 3,000 digital signal processing, analog and microcontroller laboratories in more than 600 universities in China. Every year, more than 300,000 students practice and learn through TI's laboratories and various activities.
Previous article:The sad closure of Huaxintong sounded the alarm for domestic semiconductors
Next article:ON Semiconductor acquires GlobalFoundries' New York 300mm Fab10
- Popular Resources
- Popular amplifiers
- STMicroelectronics discloses its 2027-2028 financial model and path to achieve its 2030 goals
- Chuangshi Technology's first appearance at electronica 2024: accelerating the overseas expansion of domestic distributors
- Europe's three largest chip giants re-examine their supply chains
- Future Electronics held a Technology Day event in Hangzhou, focusing on new energy "chip" opportunities
- It is reported that Kioxia will be approved for listing as early as tomorrow, and its market value is expected to reach 750 billion yen
- The US government finalizes a $1.5 billion CHIPS Act subsidy to GlobalFoundries to support the latter's expansion of production capacity in the US
- SK Hynix announces mass production of the world's highest 321-layer 1Tb TLC 4D NAND flash memory, plans to ship it in the first half of 2025
- Samsung Electronics NRD-K Semiconductor R&D Complex to import ASML High NA EUV lithography equipment
- A big chip war is about to start: Qualcomm and MediaTek are involved in notebooks, and AMD is reported to enter the mobile phone market
- Intel promotes AI with multi-dimensional efforts in technology, application, and ecology
- ChinaJoy Qualcomm Snapdragon Theme Pavilion takes you to experience the new changes in digital entertainment in the 5G era
- Infineon's latest generation IGBT technology platform enables precise control of speed and position
- Two test methods for LED lighting life
- Don't Let Lightning Induced Surges Scare You
- Application of brushless motor controller ML4425/4426
- Easy identification of LED power supply quality
- World's first integrated photovoltaic solar system completed in Israel
- Sliding window mean filter for avr microcontroller AD conversion
- What does call mean in the detailed explanation of ABB robot programming instructions?
- STMicroelectronics discloses its 2027-2028 financial model and path to achieve its 2030 goals
- 2024 China Automotive Charging and Battery Swapping Ecosystem Conference held in Taiyuan
- State-owned enterprises team up to invest in solid-state battery giant
- The evolution of electronic and electrical architecture is accelerating
- The first! National Automotive Chip Quality Inspection Center established
- BYD releases self-developed automotive chip using 4nm process, with a running score of up to 1.15 million
- GEODNET launches GEO-PULSE, a car GPS navigation device
- Should Chinese car companies develop their own high-computing chips?
- Infineon and Siemens combine embedded automotive software platform with microcontrollers to provide the necessary functions for next-generation SDVs
- Continental launches invisible biometric sensor display to monitor passengers' vital signs
- Battery power collection
- Common faults and repairs of AC release device
- CC4514 4-line to 16-line decoder (latch input)
- TI DSP specific model meaning
- What is a connector?
- Please help me analyze how this circuit works
- Computer Acceleration Record
- TI Power Supply Learning and Growth Road: DC-DC/AC-DC Converter
- Help
- How to set up PCB routing like this?