Laird Thermal Systems Announces New Line of Micro-Thermoelectric Coolers for Next-Generation Optoelectronic Devices

November 12, 2024 --- Laird Thermal Systems announced the expansion of its micro thermoelectric cooler product line and launched the OptoTEC™ MBX series, which is suitable for high-performance optoelectronic applications with space constraints. The MBX series uses next-generation thermoelectric materials and advanced automated processes to provide standard and customized options for TECs used in applications such as TO-Can, TOSA and Butterfly packages. One of the innovative designs is that it can achieve a more compact form factor, with the smallest model being only 1.5 x 1.1mm and a thickness as thin as 0.65mm, ensuring better cooling performance with the lowest possible power consumption under specific space constraints.

The MBX series has a high heat pump density of up to 43 W/cm2 and can achieve a temperature difference of up to 82°C at an ambient temperature of 50°C. The MBX series ensures efficient thermal management and precise temperature control to protect a variety of optoelectronic devices operating in high temperature environments, including laser diodes, optical transceivers, LiDAR, infrared (IR) sensors, and high-power Indium Phosphide (InP) VCSELs.

“The optical communications industry is advancing rapidly, driven by applications such as artificial intelligence and machine learning, requiring laser diodes in high-speed optical transceivers to have very high temperature stability,” said Andrew Dereka, director of thermoelectric products at Laird Thermal Systems. “The MBX Series is an ideal solution for ensuring consistent wavelength, reduced temperature drift, and extended lifetime for optics. Our significant investment in a high-precision, fully automated production line reflects our commitment to process control, high-volume capacity, and high reliability.”

The MBX series has passed the rigorous Telcordia GR-468 CORE test, ensuring excellent reliability and long service life even in harsh environments, and can meet the higher qualification and reliability standards of the optoelectronic market. The MBX series can be customized according to customer requirements to meet specific requirements such as form factor, heat pump density and cooling efficiency. The solder structure of this series can support reflow temperatures and wire welding up to 280°C, suitable for a wide range of optoelectronic applications. Laird Thermal Systems also offers a variety of special surface treatment options, including gold-plated patterns, thermistor accessories and seals to accommodate non-sealed devices.