With the widespread use of SMD white light LEDs (the main raw materials are shown in Figure 1 below), phosphors have become an indispensable part; a large number of manufacturers have smelled this business opportunity (the cost structure of SMD white light LED packaging is shown in Figure 2 below, the information comes from Korea's Displaybank) and have begun to develop in the field of phosphor production, resulting in an endless stream of phosphor brands on the market.
LED phosphors can also be called rare earth phosphors. Because rare earth element atoms have rich electronic energy levels, there are 4f orbitals in the electronic configuration of rare earth element atoms, which creates conditions for multiple energy level transitions, thereby obtaining a variety of luminescence properties (as shown in Figure 3 below):
LED phosphors can be roughly divided into the following categories according to their preparation methods: high-temperature solid-phase method, combustion synthesis method, sol-gel method, spray pyrolysis method, hydrothermal synthesis method, and chemical co-precipitation method. Among them, most phosphor manufacturers mainly use the solid-phase reaction method to prepare phosphors (the advantages and disadvantages of each preparation method are roughly shown in the following table).
Preparation method |
advantage |
shortcoming |
High temperature solid phase method |
Simple process |
High synthesis temperature and high energy consumption |
Phosphor crystallization is good |
Severe product agglomeration |
|
High brightness |
Coarse particles |
|
Combustion Synthesis |
Short reaction time |
The product is impure |
Low synthesis temperature |
Low phosphor brightness |
|
Sol-Gel Method |
Uniform ingredients |
Complex process and long reaction cycle |
High reactivity |
Phosphor crystallization is poor |
|
Low synthesis temperature |
Low brightness |
|
Spray pyrolysis |
Uniform ingredients |
There is a cavity in the middle of the particle, which is easy to collapse |
Spherical particles |
Micropores on the particle surface |
|
Good dispersibility |
|
|
Hydrothermal synthesis |
Easy to control purity and particle size |
The use is limited and the equipment requirements are high |
|
Low phosphor brightness |
|
Chemical coprecipitation |
Even mixing, low synthesis temperature |
The technology is not mature enough |
The process is simple and suitable for industrial production |
The product is prone to agglomeration |
LED phosphors can be roughly divided into blue phosphors, green phosphors, yellow phosphors and red phosphors according to their colors, among which yellow phosphors account for the majority of applications (the application methods of each color phosphor are roughly shown in the following table).
sort by color |
Application |
Blue phosphor |
UV chip + blue phosphor + green phosphor + red phosphor |
Green phosphor |
Blue light chip + green phosphor + red phosphor |
Blue light chip + green phosphor + yellow phosphor |
|
Red phosphor |
Blue light chip + green phosphor + red phosphor |
Blue light chip + red phosphor + yellow phosphor |
|
Yellow phosphor |
Blue light chip + yellow phosphor |
Phosphors can be roughly divided into the following categories according to their composition: aluminate phosphors, silicate phosphors, nitride (or oxynitride) phosphors, and sulfide phosphors. Aluminate phosphors and silicate phosphors account for the majority of applications (the excitation efficiency of each component of phosphor is roughly shown in the following table).
Ingredient Classification |
Stimulation efficiency |
Aluminate |
excellent |
Silicate |
excellent |
Nitride/
|
Difference |
Sulfide |
excellent |
Generally speaking, the evaluation items of phosphors include efficiency evaluation, chromaticity evaluation, reliability evaluation and evaluation of other related parameters. Most LED packaging manufacturers focus on efficiency evaluation and chromaticity evaluation.
According to the current market situation, due to the different process technology capabilities of various phosphor manufacturers, their product performance also has its own advantages and disadvantages. Of course, some merchants, in pursuit of huge profits, add some organic powders or inorganic salts (such as sulfides) to phosphors to pass off inferior products as good ones. Therefore, the focus of phosphor evaluation is no longer limited to the efficiency and chromaticity of the phosphor itself, and its own reliability evaluation has become increasingly important.
At present, the relevant industry organizations issued the corresponding standards on November 17, 2009 to regulate the production of phosphors (People's Republic of China Electronic Industry Standard SJ/T 11397-2009 "Phosphors for Semiconductor Light Emitting Diodes"), and its official implementation time is January 1, 2010. This standard stipulates the terms and definitions related to phosphors for semiconductor light emitting diodes, and also stipulates the requirements, test methods, detection rules and marking, packaging, transportation and storage requirements for aluminate and silicate phosphors for semiconductor light emitting diodes. However, I personally think that this standard is actually more suitable for phosphor manufacturers to verify their own products, but it cannot better guide LED packaging factories to verify the reliability of phosphors.
So how do SMD LED packaging factories choose phosphor products with better stability among the numerous phosphor brands? Here, I propose the following four phosphor stability verification schemes for everyone to discuss:
A. Heat resistance verification of phosphor:
You may encounter this problem: some end customers report that the color temperature of our products shifts after REFLOW. What material causes this shift? Is it related to the phosphor? It is difficult to separate the various raw materials and analyze them.
So how should we determine the heat resistance of the phosphor in the early stage? As we all know, when the phosphor is packaged into a SMD product, it needs to be baked at about 150℃, and when the end customer uses it, the SMD product will be assembled on the PCB through REFLOW, and the highest reflow temperature is 260℃. In other words, when the phosphor is used in the early stage, the highest temperature it withstands is 260℃. Therefore, we can set the temperature of the heat resistance experiment at 260℃.
From the above, we can see that we have the following two verification schemes to choose from:
|
Solution 1 |
Solution 2 |
Program Content |
Place the phosphor in an oven at 260°C and bake directly |
Place the phosphor in REFLOW for baking |
Heating method |
Constant temperature heating |
Saddle curve heating |
Heating curve |
Figure 4 |
As shown in Figure 5 (this information comes from JEDEC) |
advantage |
Sustainable heating |
How to get close to customers |
Since our end customers actually use a saddle-shaped temperature curve, in order to better simulate the customer's usage method, it is the best choice to use Option 2 to verify the heat resistance of the phosphor. Perhaps before you conduct this experiment, your phosphor supplier will tell you that the sintering temperature of the phosphor is above 1000℃, so it is unnecessary to bake the phosphor at 260℃, and the phosphor will not decompose no matter how long it is baked. But don't forget that there are many post-processing steps in the phosphor manufacturing process (such as coating). Can the phosphor particles after the post-processing steps also withstand baking at 260℃ or even above 1000℃ without affecting the excitation efficiency of the product? If other substances are added to the phosphor, can this substance withstand 260℃ without decomposition? This depends on the post-processing process of each company.
The following are related experiments conducted by our company using Nitto's eight-zone lead-free reflow soldering (upper eight and lower eight zones). Figure 6 is a phosphor sample with better reliability, and Figure 7 is a phosphor sample with poorer reliability. The experiment proves that this solution can effectively verify the reliability of phosphors.
Figure 6
B. Verification of the moisture resistance of phosphors:
When our end customers use our products, the surrounding environment has a certain humidity. If our products have color temperature deviation, is this caused by the phosphor itself? And how should we verify the humidity resistance of phosphors in the early stage?
Normally, when the phosphor and encapsulation glue are fully mixed and cured, the encapsulation glue itself will play a certain role in moisture-proofing and moisture-proofing, thereby protecting the phosphor from hydrolysis. However, each encapsulation glue itself has a certain degree of airtightness, that is, water vapor can penetrate into the encapsulation colloid to varying degrees and react with the phosphor; therefore, the moisture resistance of the phosphor is greatly affected by the airtightness of the encapsulation glue. The airtightness of existing encapsulation glues is roughly as follows:
Packaging glue |
Airtightness |
Epoxy |
excellent |
Silicone Rubber |
Difference |
Silicone |
middle |
Since the air tightness of each packaging glue is different, the results of moisture resistance verification using the same phosphor will be different. In this way, we cannot verify the moisture resistance of the phosphor more objectively;
In order to more objectively verify the moisture resistance of phosphors (including possible added substances), we have two options. One is to soak the phosphors in neutral water, and the other is to store the phosphors in a high humidity (90%RH) machine. When the first solution is used for verification, the humidity can be regarded as 100%RH, but this solution is more demanding for phosphors (especially silicate phosphors. From our company's current experimental results, as shown in Figure 8 below, almost all phosphor manufacturers' products cannot pass this experiment); when the second solution is used for verification, the water contacts the phosphors in gaseous form, which is closer to the actual product failure mechanism. (Even for silicate phosphors, from our company's current experimental results, as shown in Figure 9 below, it is found that the products of some foreign phosphor manufacturers have better moisture resistance than those of the same industry.)
C. Thermal stability test of phosphor
The heat resistance of phosphor is different from thermal stability. Heat resistance focuses on the early performance of phosphor, which is a transient verification; while thermal stability focuses on the later performance of phosphor, which is a relatively long-term verification. Although some phosphor testers in the industry can test the excitation efficiency of phosphor samples at different temperatures, most testers only heat the bottom of the sample powder tray. In fact, when the phosphor tester tests the sample, it receives the spectrum excited by the phosphor on the surface of the sample powder tray (the principle is shown in Figure 10). Since the thermal conductivity of the phosphor itself is relatively poor, if only the bottom of the powder tray is heated to test the phosphor sample, the value obtained is very inaccurate. This is because the machine may set the heating temperature to 120℃, and the actual temperature of the powder tray is also 120℃, but the phosphor on the surface of the powder tray is far below this temperature.
A relatively better way is to use space heating, that is, to place the entire powder tray in hot air so that the phosphor sample on the surface of the powder tray is fully heated. The test results of this method are more accurate. However, the equipment cost will be relatively expensive. If the LED packaging factory conducts this verification, the initial equipment investment cost is relatively high. Therefore, a more reasonable verification scheme is to fully mix the phosphor with the packaging glue to solidify it into a finished product, and then perform high-temperature aging. (Of course, when using this scheme for verification, you should use chips with better reliability and packaging glue with better airtightness and better anti-attenuation performance, etc.), and then compare its attenuation data after a certain aging time (usually aging 1000HRS).
D. Test of the UV resistance of phosphors
Most LEDs in the industry now use blue light chips and phosphors to produce white light. However, the blue light chip itself has a certain amount of energy in the ultraviolet part. The shorter the chip band, the more energy there is in the ultraviolet part. The phosphor itself absorbs part of the ultraviolet energy and converts it into visible light (as shown in Figure 11).
When the phosphor absorbs ultraviolet energy, it will also accelerate the aging of the phosphor itself. Especially when the post-processing technology of the phosphor is poor and some organic powders or inorganic salts (such as sulfides) are added to the phosphor, its anti-ultraviolet performance becomes more important.
Based on the above four solutions, their respective characteristics are as follows:
project |
name |
effect |
Solution 1 |
Heat resistance |
Verify the high temperature resistance of the phosphor in the transient state in the early stage |
Solution 2 |
Moisture resistance |
Verify the moisture resistance of phosphors |
Option 3 |
Thermal stability |
Verify the high temperature resistance of the phosphor in the later stage when it is in a stable state |
Option 4 |
UV resistance |
Verify the performance of phosphors against UV energy |
The heat resistance, moisture resistance, thermal stability and UV resistance of phosphors determine the reliability of phosphors. Only when these four properties reach certain standards can they meet the requirements of white light LEDs. I hope everyone can evaluate the most suitable phosphor for their products among the many phosphor manufacturers.
Previous article:Analysis of heat dissipation design and application trend of high power LED
Next article:LED packaging technology and the application of phosphor in packaging
Recommended ReadingLatest update time:2024-11-16 16:22
- Popular Resources
- Popular amplifiers
- MathWorks and NXP Collaborate to Launch Model-Based Design Toolbox for Battery Management Systems
- STMicroelectronics' advanced galvanically isolated gate driver STGAP3S provides flexible protection for IGBTs and SiC MOSFETs
- New diaphragm-free solid-state lithium battery technology is launched: the distance between the positive and negative electrodes is less than 0.000001 meters
- [“Source” Observe the Autumn Series] Application and testing of the next generation of semiconductor gallium oxide device photodetectors
- 采用自主设计封装,绝缘电阻显著提高!ROHM开发出更高电压xEV系统的SiC肖特基势垒二极管
- Will GaN replace SiC? PI's disruptive 1700V InnoMux2 is here to demonstrate
- From Isolation to the Third and a Half Generation: Understanding Naxinwei's Gate Driver IC in One Article
- The appeal of 48 V technology: importance, benefits and key factors in system-level applications
- Important breakthrough in recycling of used lithium-ion batteries
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- [Xianji HPM6750EVKMINI Review] 1# Hardware Introduction and Development Environment Construction
- How can an electric mosquito swatter kill mosquitoes without harming people? Is it because the voltage is high and the time is short? Isn't that related to ESD?
- Competition sharing, Xiaobai unboxing
- Tips for beginners in electronics
- FPGA design solutions for various EDA tools
- I need help~What is the interface level standard of DAC8812ICPW?
- Today's broadcast starts at 10:00: Interpreting ON Semiconductor's power solutions and understanding the latest power technology trends
- Antenna-on-Package Design Simplifies mmWave Sensing in Buildings and Factories
- [FS-IR02 + D1CS-D54] - 0: Study two PDFs
- Peak Detection