Application Solution in LED Die Bonding Machine - 4U Complete Machine

System Overview

With the development of IT industry and semiconductor industry, the integrated circuit market has shown a steady growth trend. The vigorous development of LED industry has put higher and higher requirements on LED production equipment, and the demand for semiconductor equipment such as die bonders in the market has increased. At the same time, the rapid development of IPC technology has provided a guarantee to meet the above needs. Therefore, special computer control, processing and machine vision with high reliability and stability are widely used in the die bonder industry, which greatly improves the automation of LED die bonders and optimizes the equipment in terms of accuracy, speed, human-computer interaction and other aspects.

Many LED automation equipment providers in Shenzhen have long been committed to the research and development, production, sales and service of electronic components and equipment. They are strong in the manufacturing of LED die-bonding machines. When selecting the central computer control system of the die-bonding machine, they reached a friendly cooperation with North China Industrial Control. The North China Industrial Control 4U complete machine was selected as the control host by the LED die-bonding machine system integrator, and customers reported good application results. The following is a detailed introduction to the application of the North China Industrial Control 4U complete machine in the LED die-bonding machine.

System Principle

LED die bonder is an automated device that absorbs LED chips from the chip tray and mounts them on the PCB (printed circuit board), realizing automatic bonding of LED chips and defective chip detection. It can meet the needs of most LED production lines and is suitable for the production of various high-quality, high-brightness LEDs (red, green, white, yellow, etc.). Some of them can be used for the production of triodes, semiconductor discrete devices, DIP and SOP and other products. It has a wide range of applications and strong versatility.

The LED die bonding machine system structure mainly includes motion control module, pneumatic part, machine vision part and motion actuator module, and realizes data communication with special computer control center through PCI bus interface .

Working principle: The loading mechanism transfers the PCB to the working position on the workbench fixture. The dispensing mechanism first dispenses glue at the position where the PCB needs to be bonded with the wafer. Then the bonding arm moves from the origin position to the wafer suction position. The wafer is placed on the expander wafer disk supported by the film. After the bonding arm is in place, the suction nozzle moves downward, and the ejector moves upward to lift the wafer. After picking up the wafer, the bonding arm returns to the origin position (leakage crystal detection position). The bonding arm moves from the origin position to the bonding position again. After the suction nozzle bonds the wafer downward, the bonding arm returns to the origin position again. This is a complete bonding process. When a beat is completed, the machine vision detects the data of the next position of the wafer and transmits the data to the wafer disk motor. After the motor travels the corresponding distance, the next wafer moves to the aligned wafer pickup position. The dispensing bonding position of the PCB board is the same process until all the dispensing positions on the PCB board are bonded with wafers. Then the conveying mechanism removes the PCB board from the workbench and installs a new PCB board to start a new working cycle.

System Advantages

The motion control part of the LED die bonder system is realized by servo motors and stepper motors . The motion of each motor is controlled by an industry-specific computer and motion control card. The industry-specific computer is the core part of the LED die bonder control system. It is mainly responsible for the management of the human-machine interface and the real-time monitoring of the control system, issuing motion instructions, and effectively processing the information collected and transmitted by the control card, so that each link can achieve the expected motion and ensure the mechanical position accuracy detection and operation safety.

Under the control of industry-specific computers on the Windows platform, the LED die-bonding machine system can make full use of hardware resources, greatly speed up data processing, and improve system operating efficiency.

System Block Diagram

System Configuration

Industrial chassis: 4U curved door industrial chassis

◆ 4U, 19-inch rack mountable, European and American style, compliant with EIARS-310C standard
◆ Up to 5 3.5" drives can be installed
◆ Front panel with lock to prevent misoperation, 2 USB ports on the front
◆ Front panel provides power and hard disk indicator
◆ Special arc pressure beam design, arc pressure strip height adjustable

Full-length industrial CPU card

◆ Soc ket 478 interface supporting hyperthreading technology , full range of Intel Pentium 4 processors
◆Adopt Intel 865GV+ IC H5 chipset
◆2 184Pin DDR DIMM slots, supporting dual channels, DDR 266/333/400MHz, up to 2GB
◆North bridge integrated graphics card, up to 96MB system memory dynamically shared as video memory
◆AC'97 CODEC, providing Speak out, Line-IN, MIC-IN, CD-IN functions
◆RTL8100C controller , 1 10/100Mbps RJ45 interface
◆LAN/2IDE/2SATA/4USB/LPT/2COM/FDD

Industrial baseboard: PBP-15P12
Power supply: PW-300 Hard disk: 80G

Systematic review:

The system of North China Industrial Control has been adopted by system integrators, has been widely used in LED automation equipment, and has received high praise.