To prevent moisture, LEDs should be stored in a dry and ventilated environment with a storage temperature of -40℃- +100℃ and a relative humidity below 85%.
The LED should be used within 3 months in its original packaging to avoid rusting of the bracket.
After the LED packaging bag is opened, it should be used up as soon as possible. The storage temperature should be 5℃-30℃ and the relative humidity should be below 60%.
clean
Do not use unknown chemical liquids to clean LEDs, as this may damage the LED resin surface or even cause colloid cracks. If necessary, immerse the LED in alcohol or fluorine at room temperature for less than one minute.
Forming
Do not perform shaping during or after welding. If necessary, shaping must be done before welding.
Keep in mind that any squeezing of the resin may damage the gold wires inside the LED.
welding
During the soldering process, do not apply any external pressure to the lamp body, otherwise cracks may appear inside the LED, which will affect its internal gold wire connection and cause quality problems.
The colloid must not be immersed in the solder.
When welding, there should be at least 2 mm gap between the welding point and the bottom edge of the colloid. After welding, it is necessary to take three minutes for the LED to return from the high temperature state to normal temperature.
If you use a soldering iron to solder LEDs that are linearly arranged on the same PCB, do not solder two pins of the same LED at the same time.
When soldering with a soldering iron, a soldering iron of less than 30W is required.
There are two specifications for LED welding methods, the specific parameters are as follows:
Soldering temperature: 295℃±5℃ Soldering time: within 3 seconds (only once)
Wave soldering temperature: 235℃±5℃ Soldering time: within 3 seconds
Note: Improper control of welding temperature or time may cause deformation of LED lens or open circuit inside the wick, resulting in dead light.
Recommended use
During use, whether using a single LED or multiple LEDs, the recommended DC drive current IF range for each LED is 10mA-20mA.
A momentary pulse can damage the fixed connection inside the LED, so the circuit must be carefully designed so that the LED will not be subjected to overvoltage (overcurrent) shock when the circuit is opened and closed.
When multiple LEDs are used, the brightness and color of the light must be consistent. Therefore, the driving method and driving conditions must be fully understood. Under normal conditions, our company guarantees the consistency of color and brightness of 20 mA spectral analysis.
To obtain uniform brightness and color, LEDs from the same batch should use the same current and should not be mixed to avoid brightness differences.
For details on the relationship between LED's VF, IF, IV, WL and temperature, please refer to the product specification.
ESD (Electrostatic Discharge Protection)
Static electricity can cause LED function failure, so it is recommended to prevent ESD from damaging the LED.
A. When testing and assembling LEDs, operators must wear anti-static wrist straps and anti-static gloves.
B. Welding equipment, testing equipment, work tables, storage racks, etc. must be well grounded.
C. Use an ion fan to eliminate static electricity generated by friction during storage and assembly of LEDs.
D. The box for LED should be anti-static and the packaging bag should be anti-static bag.
LEDs damaged by ESD may experience the following abnormal phenomena:
A. Reverse leakage, in mild cases it will cause the brightness to decrease, in severe cases the light will not turn on.
B. The forward voltage value becomes smaller.
LEDs cannot emit light when driven at low current.
Previous article:LNK406EG14W dimmable, high efficiency LED driver design
Next article:LED unit board fault analysis and repair
Recommended ReadingLatest update time:2024-11-16 17:52
- Popular Resources
- Popular amplifiers
- MathWorks and NXP Collaborate to Launch Model-Based Design Toolbox for Battery Management Systems
- STMicroelectronics' advanced galvanically isolated gate driver STGAP3S provides flexible protection for IGBTs and SiC MOSFETs
- New diaphragm-free solid-state lithium battery technology is launched: the distance between the positive and negative electrodes is less than 0.000001 meters
- [“Source” Observe the Autumn Series] Application and testing of the next generation of semiconductor gallium oxide device photodetectors
- 采用自主设计封装,绝缘电阻显著提高!ROHM开发出更高电压xEV系统的SiC肖特基势垒二极管
- Will GaN replace SiC? PI's disruptive 1700V InnoMux2 is here to demonstrate
- From Isolation to the Third and a Half Generation: Understanding Naxinwei's Gate Driver IC in One Article
- The appeal of 48 V technology: importance, benefits and key factors in system-level applications
- Important breakthrough in recycling of used lithium-ion batteries
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Microsecond latency, wireless communication solution
- Use STM32 Universal Bootloader to make OTA easier
- MLCC Noise Howling and Countermeasures
- Design of brushless DC motor driver based on hardware FOC TMC4671
- [ART-Pi Review] VI: Review of ATT-Pi's onboard Flash file system and FTP functions in RTT Studio environment
- Use transistor + MOS tube to control battery output
- Contemporary IoT smart antenna design trends | Review TE's exciting live broadcast, write a comment and win a gift!
- VLSI Digital Signal Processing Systems: Design and Implementation
- A foreign guy pranked: using ESP32 microcontroller disguised as GPU to infect his friend's computer with "ransomware"
- 13 Rules You Must Read for RF Circuit Power Supply Design