According to THE CHOSUN Daily, Samsung has completed the development and mass production of Bot Fit, and the company plans to launch its first wearable assistive robot in the third quarter of this year.
IT Home learned from the report that Bot Fit is designed to help individuals with limited mobility and enhance physical activity. Samsung has been providing Bot Fit prototypes to elderly communities since the end of last year and plans to enter the B2C market within the year.
In order to strengthen its robotics business, Samsung has reportedly reorganized its organization by disbanding the robotics business team in the Device Experience Division and reallocating R&D personnel under the leadership of the Chief Technology Officer. A Samsung representative explained, "The R&D team has completed the development of Bot Fit and is preparing for the next step. This reorganization is aimed at strengthening the robotics business."
Samsung also appointed Cho Hye-kyung, a robotics expert and professor of applied artificial intelligence at Hansung University, as a new external director. Last year, Samsung Research Institute hired former Nvidia engineer Kwon Jung-hyun as an executive, further strengthening its robotics expertise.
The report also revealed that Samsung is also developing the next generation of humanoid robots, a project that has attracted the keen interest of Samsung Chairman Lee Jae-yong.
Samsung originally planned to release the GEMS Hip assistant robot in limited quantities in December 2022 and start mass production in the second half of 2022, but this plan did not materialize. In November 2023, Samsung renamed it Bot Fit.
In addition, another Korean company, LG Electronics, will showcase its service robot CLOi, which uses Google's generative AI model Gemini, at the Google Cloud Summit on June 27. The two companies have been working together since last year and may go public in the second half of this year.
Previous article:Qualcomm is reportedly providing Snapdragon XR2/2+ Gen 3 samples to VR headset manufacturers: supports 16GB RAM, UFS 4.0
Next article:IDC: China's wearable device market shipped 33.67 million units in the first quarter of this year, a growth rate four times that of the world
Recommended ReadingLatest update time:2024-11-16 09:31
- Popular Resources
- Popular amplifiers
- e-Network Community and NXP launch Smart Space Building Automation Challenge
- The Internet of Things helps electric vehicle charging facilities move into the future
- Nordic Semiconductor Launches nRF54L15, nRF54L10 and nRF54L05 Next Generation Wireless SoCs
- Face detection based on camera capture video in OPENCV - Mir NXP i.MX93 development board
- The UK tests drones equipped with nervous systems: no need to frequently land for inspection
- The power of ultra-wideband: reshaping the automotive, mobile and industrial IoT experience
- STMicroelectronics launches highly adaptable and easy-to-connect dual-radio IoT module for metering and asset tracking applications
- This year, the number of IoT connections in my country is expected to exceed 3 billion
- Infineon Technologies SECORA™ Pay Bio Enhances Convenience and Trust in Contactless Biometric Payments
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Analysis of the method of updating the serial port application program of MSP430
- Thank you for having you +EEWORLD
- Misalignment issues between 3D packaging and planar packaging
- EEWORLD University Hall ----Embedded Systems and Experiments Xiamen University
- Storage DDR SAMSUNG MICRON
- Near Field Communication (NFC) Transceiver Reference Design
- In electromagnetic field simulation, what are the advantages and disadvantages of FDTD and FEM algorithms?
- X-NUCLEO-IKS01A3 sensor driver transplantation based on STM8S-DISCOVERY
- TMDSEVM572X development board link emulator
- TI TMS320F2812 SVPWM Program