In June 2021, Lingsi Microelectronics completed its Series A financing. According to the announcement at the time, the core team members of Lingsi Microelectronics have rich experience in wireless RF, communication algorithms, SOC design, and software solutions. It has now achieved mass production of the first Bluetooth BLE5.0/5.1 chip product, with key performance reaching a first-class level, and has passed the BLE5.xBQB certification, including a full set of RF, Linklayer, and MESH certifications.
Excellent wireless performance
According to public information on the Internet, Lingsi Microelectronics' Bluetooth BLE5.0/5.1 SoC product LE501X/LE511X series has the world's leading technical performance indicators. LE5010/5110 are SOC chips that support BLE5.0 and 5.1 full protocols respectively, and can be widely used in BLE application fields such as positioning, networking and data transmission.
Its comprehensive performance index is in the leading position in China, and its key index radio frequency has reached a relatively high international level, with a sensitivity of -100dBm@1Mbps, which ranks first in the world and exceeds that of its international counterparts by 4dBm. In terms of signal transmission, it integrates two PAs, and the link gain is 113dB@1Mbps.
In terms of transmission distance, the theoretical communication distance of 113dB can reach 400 meters, and the measured effective communication distance exceeds 200m (sending 0dBm, 1Mbps rate). If it is BLE 5.0, at a transmission rate of 125kbps, the communication distance is nearly one kilometer, which is relatively rare in Bluetooth applications.
In addition, Lingsiwei's products also have the advantage of low power consumption. The working power consumption is 4.3mA, and the lowest standby mode is only 600nA.
Third, Lingsiwei's products can be used in high-reliability and high-security industrial fields. They have built-in encryption modules, strong anti-interference and ESD resistance of up to 8000V.
Due to its excellent RF performance, low power consumption and high reliability, Lingsiwei's electronic products have obtained Alibaba's centralized procurement certification, the State Grid's IR46 meter standard, and have received batch orders from many benchmark customers such as Alibaba, Huawei, and the State Grid. In addition, based on the company's understanding of the consumer electronics market, Lingsiwei has actively defined a number of products including Bluetooth 5.2, UWB, and WIFI6, and will continue to make efforts in the fields of consumer electronics and industrial manufacturing.
The company has currently shipped over 30 million units.
From Arm to RISC-V
Recently, at the first Dishui Lake China RISC-V Industry Forum co-organized by the China RISC-V Industry Alliance, VeriSilicon Microelectronics and Shanghai Integrated Circuit Industry Cluster Development Promotion Organization, Wang Zhenshan, vice president of Lingsi Microelectronics, introduced the company's new generation of automotive-grade wireless MCU based on RISC-V - LE503X, which uses a RISC-V core based on Hematite E902.
In addition, Lingsiwei also has MCUs based on the Hematite E906 series.
Wang Zhenshan, Vice President of Lingsi Microelectronics
Wang Zhenshan said that the new product is a continuation of the previous Arm CM-0/CM-3 products. The choice of RISC-V for automotive chips is "the general trend". When Lingsiwei contacted many domestic manufacturers, the most important product demand it received was to ensure localization. In addition, from a cost perspective, the charging mechanisms of the two architectures, Arm and RISC-V, are also different. For chip industry startups, this reason is "very tempting". In addition, Wang Zhenshan also said that as the open source ecology and support system of RISC-V become more and more perfect, product development efficiency has also increased rapidly, and has not slowed down due to the replacement of the core.
With Lingsiwei's accumulation in the wireless field, LE503X performs particularly well in radio frequency and other aspects. The specific features are as follows:
High RF sensitivity: -99dBm@1Mbps, -106dBm@125Kbps
High RF link gain: 113dB@1Mbps, 120dB@125Kbps
Strong reliability: supports a wide operating temperature range of -25℃~125℃, and has an ESD resistance of 8KV;
Flexible I/O configuration: All GPIO interfaces can be flexibly configured as needed, and only 3 peripheral circuit devices are required;
Rich peripherals: integrated with 24-bit AD, LCD driver, TP, USB and other functions.
The first one on the right is an evaluation board equipped with the Lingsiwei MCU chip LE503x
Strong demand for in-vehicle wireless market
When talking about the demand for in-vehicle wireless market, Wang Zhenshan introduced the world's first wireless BMS system displayed by General Motors. Through 2.4GHz wireless technology, the battery module is not restricted by wiring harnesses, which can better meet communication and upgrade needs, while greatly reducing the size and weight of the BMS system.
Wang Zhenshan said that the combination of wireless, automotive regulations and MCU may become a new market breakthrough point, and Lingsiwei has corresponding strengths in these three aspects.
It is for this reason that Lingsiwei began to improve its specifications and methodologies in automotive-grade design, upgrading from a previous consumer and industrial wireless MCU supplier to an automotive-grade supplier.
Wang Zhenshan said that automotive-grade chips have more stringent requirements in all steps, from system and architecture design to verification and testing, and the final PCB, which means higher investment and engineers need to have many years of relevant experience. When making automotive-grade chips, the investment in equipment and engineer experience and knowledge is extremely complex.
"Overall, automotive-grade is a comprehensive capability that requires a systematic process operation system," said Wang Zhenshan.
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