Although rumors about Apple's VR headset have been circulating for years, the company has yet to release any concrete information. However, it has been reported recently that Apple's VR headset has entered the trial production phase with TSMC and will be released in 2022. Apple is said to use a special CMOS sensor, which is usually quite space-consuming.
The Information pointed out that the sensor is used to collect high-resolution image data of the user's surroundings and used for augmented reality (AR) experience. However, it is reported that TSMC is still working hard to overcome the problem of low chip yield.
In addition, the revelation confirmed a long-standing rumor that the Apple VR headset is a tethered device that requires the computing power of an iPhone/iPad to unlock most of the functional experience, but can be paired and connected wirelessly.
The benefit of doing so is that it can further reduce the complexity of Apple's VR headset. The built-in chipset reportedly lacks some advanced technologies on modern iPhones, such as the neural engine.
It is said that Apple has completed most of the work including chipset design, the physical design of two other Apple-developed chips, and the development of image sensors and display drivers in 2020, and is currently in trial production.
Leaked reports say the Apple VR headset will have an 8K resolution screen, advanced eye tracking, a hybrid ultra-short focal length Fresnel lens made of plastic, and weigh less than 150 grams.
Of the total 15 camera modules, eight are dedicated to core AR/VR experiences, while the rest will be used for unspecified biometric features.
Earlier this year, rumors circulated that Apple was planning to release an Apple VR headset sometime this year. Bloomberg’s Mark Gurman noted:
However, according to the latest leaks, the device will be provided to developers first and then put on the consumer market. After releasing the AR/VR headset in 2022, the company is expected to launch new products that support pure AR experience in 2023.
Previous article:Dialog provides WiRa™ chip solutions for Carnival Cruise Line's wearable devices
Next article:Luxexcel's view: China will become the main driver of growth in the consumer market for smart glasses
- Popular Resources
- Popular amplifiers
- e-Network Community and NXP launch Smart Space Building Automation Challenge
- The Internet of Things helps electric vehicle charging facilities move into the future
- Nordic Semiconductor Launches nRF54L15, nRF54L10 and nRF54L05 Next Generation Wireless SoCs
- Face detection based on camera capture video in OPENCV - Mir NXP i.MX93 development board
- The UK tests drones equipped with nervous systems: no need to frequently land for inspection
- The power of ultra-wideband: reshaping the automotive, mobile and industrial IoT experience
- STMicroelectronics launches highly adaptable and easy-to-connect dual-radio IoT module for metering and asset tracking applications
- This year, the number of IoT connections in my country is expected to exceed 3 billion
- Infineon Technologies SECORA™ Pay Bio Enhances Convenience and Trust in Contactless Biometric Payments
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- msp432 record 1-gpio usage
- [Environmental Expert’s Smart Watch] Part 18: Downhole Mode
- Discussion on the Working Principle of UWB Technology
- The flag bit has been cleared before the general interrupt is turned on, but the interrupt still occurs. How to solve it?
- Keysight Thanksgiving Month | Oscilloscopes are being drawn every day. Recommend and share. More than 100 gifts are waiting for you!
- [Xianji HPM6750 Review 5] LittlevGL transplantation using SPI display
- TI Embedded Live Month - Registration starts now to support efficient, intelligent and low-power system design~
- Four input modes of MCU
- How to replace TMS320C6416TGLZ7 chip
- I would like to ask how to connect the ground on the PCB board of the monitoring equipment and the board ground?