It’s settled! SMIC will hold a meeting on the Science and Technology Innovation Board on the 19th

On June 10, the Shanghai Stock Exchange Science and Technology Innovation Board Listing Committee is scheduled to review the initial public offering application of Semiconductor Manufacturing International Corporation on June 19, which means that SMIC will officially return to the A-share market on the 19th, setting the fastest record in China - it took only 18 days to complete the entire process and enter the domestic stock market.

According to information, SMIC's previous listing model was the United States + Hong Kong, but it withdrew from the U.S. market in May last year. Now it is applying for a domestic listing, which will become an A (science and technology innovation) + H share model.

In 2019, SMIC mass-produced the most advanced 14nm process in China and has been manufacturing for Huawei's Kirin 710A processor. Currently, SMIC is returning to the A-share market and plans to raise 20 billion yuan, mainly to invest in the development of advanced processes such as 14nm.

On the evening of June 7, SMIC announced its response to the first round of review inquiry letters on the Shanghai Stock Exchange, setting a new record in just four days. Among the six categories and 29 questions, the most eye-catching was the disclosure of details of the new process.

SMIC said that the 14nm wafer foundry capacity is in the initial layout stage, so the global share is relatively low. However, the first-generation 14nm FinFET technology has entered the mass production stage, and is technically at the international leading level and has a certain cost-effectiveness. It has currently cooperated with many customers and predicts that the capacity utilization rate can be stably maintained at a high level.

SMIC revealed that the chips made on wafers using its advanced FinFET technology have been used in the field of smartphones. Although it did not further clarify, it is obviously referring to Huawei's Kirin 710A.

In the development of next-generation technology nodes, there are only two pure-play wafer foundries left in the world: TSMC and SMIC. The second-generation FinFET technology has now entered the customer introduction stage and is expected to improve performance by about 20% and reduce power consumption by about 60% compared to the first generation.