TSMC is reluctant to accept the US invitation

Latest update time：2021-09-01 05:59

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In order to prevent being strangled, the Trump administration in the United States is trying hard to win over the world's top semiconductor companies, such as Intel, Samsung, and TSMC, to build the most advanced wafer fabs in the United States. Among them, Intel, as an American company, is very active in this regard, while the attitudes of Samsung and TSMC are somewhat intriguing.

Currently, Samsung and TSMC each have a wafer fab in Austin and Washington State, USA, respectively. However, the scale is not large and they are mainly used for research and development and testing. The technology is not the most advanced and cannot meet the requirements of the US government.

In addition to a 16nm wafer fab in Nanjing, TSMC's main forces are all local, including the most advanced 7nm and 5nm processes. The current 3nm factory project with a cost of up to US$20 billion is also in Tainan, and there is no intention to build a factory overseas.

In response to the US government's enthusiastic offer, TSMC has stated many times before that it is continuously evaluating the possibility of building factories overseas, and the United States is one of the options.

However, TSMC's attitude is firm. No decision has been made yet and comprehensive consideration is needed.

Previously, TSMC proposed three conditions for building a factory in the United States, namely, economic effectiveness, cost advantages, and complete personnel and supply chain. Only when these factors are met will it be possible to build a factory in the United States.

For semiconductor factories, capital, technology, manpower and customers are all important factors. The decision to build a factory is not made casually, otherwise the investment of tens of billions of dollars will be difficult to recover.

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