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The 12-inch wafer fab goes bankrupt!

Latest update time:2023-09-01
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Recently, after seeking a new round of investment to no avail, Jiangsu Times Chip Memory Co., Ltd. gave up its last struggle. This 12-inch wafer fab with a total planned investment of 13 billion yuan and an annual output of 100,000 pieces of phase change memory officially entered bankruptcy. Liquidation process!
With the bankruptcy of Times Xincun, the company's assets were also liquidated, including semiconductor equipment that was auctioned. The People's Court of Huaiyin District, Huai'an City, Jiangsu Province officially accepted the bankruptcy liquidation case of Jiangsu Times Xincun Semiconductor Co., Ltd. in July 2023. And held a public auction for an ASML lithography machine of the company.
However, no seller was found for this lithography machine, and the auction was eventually cancelled. It is understood that Times Core originally purchased this second-hand lithography machine for US$28.68 million, equivalent to approximately 210 million yuan. Taking into account the other 54 main equipment and 290 auxiliary equipment, the equipment value is as high as 1.5 billion.

This company was founded in 2016 and is committed to developing and producing storage products equipped with the latest PCM phase change storage technology. It later announced an investment of 13 billion in the research and development of PCM chips. This company is on the same technical route as Intel's Optane chips and claims to have complete knowledge. It is the third company after Samsung and Micron to own memory technology and independent intellectual property rights.

According to their plan, the 13 billion investment project will first produce medium and low-density PCM chips. In 2019, they will launch the high-density phase change chip 2D XPoint. In 2021, they will launch the second phase phase change products MLC, 3D XPoint, and neural network intelligence. Store products.

According to the official statement, Times All-Chip will be committed to the research of different architectures of multi-cell memory (MLC), cross-point structure (3DX Point), and manufacturing process block (Process Macro), and gradually complete the large-capacity PCM memory below 20 nanometers ( 128Gb/256Gb) process technology and product functionality verification.


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