TE Connectivity launches microQSFP connector to support next-generation data center infrastructure

New connector features 33% greater panel contact density for greater data throughput

Shanghai, China – TE Connectivity (TE), a global leader in connectivity and sensors, announced the launch of its next-generation pluggable input/output (I/O) interconnect solution, the micro quad small form factor pluggable (microQSFP) product line on July 27, 2016. The microQSFP connector can help address the main challenges of data storage centers, including bandwidth, thermal performance, and energy consumption. TE is the first member of the microQSFP Multi-Source Agreement (MSA) organization to bring microQSFP to market, which has created a new ecosystem for microQSFP in the industry and ensured the smooth integration and application of the product in existing data center designs.

Consumers' growing demand for video content dissemination and streaming Internet services has put forward higher requirements for bandwidth, but the size and external heat sink of standard I/O connectors in existing devices limit the improvement of data throughput. microQSFP can achieve the same excellent performance as QSFP28, but its size is smaller than QSFP28, the same as SFP, and provides better thermal performance to save energy. At the same time, this product line not only improves electronic performance to 25Gbps per channel, but also increases contact density by 33% over QSFP to accommodate more ports on a single standard line card.

Phil Gilchrist, CTO of TE Data and Devices, said: "The market continues to place higher demands on product panel size and thermal performance. TE's microQSFP products not only fully meet these two requirements, but its technological innovation can also support up to 100Gbps per 72 ports on a 1RU line card, thus leading the innovation of the connector industry."

The new microQSFP meets the needs of next-generation designs with 56Gbps per channel transmission performance and backward compatibility of 28Gbps per channel. Its built-in heat sink integrates the functions of additional clips and heat sink parts, and helps achieve panel air flow inside the device, allowing microQSFP to achieve better thermal performance than existing advanced solutions such as QSFP28.

TE's microQSFP connectors are the first products to be released to the market by the microQSFP MSA. TE and 19 other industry-leading connector suppliers and manufacturers have formed the microQSFP Multi-Source Agreement (MSA). For more information about the microQSFP MSA, please visit www.microQSFP.com .

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