Microchip Introduces Next-Generation Bluetooth® Low Energy Solution

Fully Bluetooth 4.2 -compliant chips, modules and software provide IoT developers with exceptional design flexibility and cost savings

Microchip Technology Inc., a global leading supplier of integrated microcontrollers, mixed-signal, analog devices and flash patent solutions, recently announced the launch of the next generation of Bluetooth® low energy (LE) solutions. The IS1870 and IS1871 Bluetooth LERF ICs and BM70 modules comply with the latest Bluetooth 4.2 standard, which not only expands Microchip's existing Bluetooth product portfolio, but also passes global regulatory and Bluetooth Technology Alliance (SIG) certification. These new products are ideal for IoT and Bluetooth beacon applications, allowing designers to easily use the low energy consumption and simplicity of Bluetooth low energy connections.

Microchip's new Bluetooth low energy devices all include an integrated Bluetooth 4.2 firmware stack. Developers can achieve up to 2.5 times faster data transmission speeds and higher connection security, and support government-level (FIPS-based) secure connections. Data will be sent and received over the Bluetooth link in transparent UART mode, making it easy to integrate with any processor or Microchip's hundreds of PIC® microcontrollers with a UART interface. In addition, the new module also supports independent "host-less" operation for beacon applications.

“The IS1870 and IS1871 ICs provide our silicon customers with cutting-edge Bluetooth 4.2 performance, while the BM70 module enables our customers to avoid the expense and product delays associated with regulatory certification,” said Sumit Mitra, vice president of Microchip’s Wireless Solutions Group. “By offering one-stop shopping, including our own Bluetooth protocol stack, customers gain the convenience of proven interoperability and one-on-one support from Microchip’s global team of wireless experts.”

These new devices have optimized power distribution to minimize current consumption, thereby extending battery life. In addition, these new devices are compact in size, with the smallest RF IC size being 4x4 mm and the smallest module size being 15x12 mm. Module options are available with RF regulatory certification, or uncertified (unshielded/no antenna) modules for smaller and more remote antenna designs to allow for self-certification of end-product emissions.

Microchip's Bluetooth low energy modules include all the hardware, software and certifications that designers need. Developers can easily submit their products to the Bluetooth Special Interest Group (SIG) using Microchip's Bluetooth QDID certification. Embedded Bluetooth protocol stack profiles include GAP, GATT, ATT, SMP and L2CAP, as well as proprietary services for transparent UART. All modules can be configured using Microchip's Windows® operating system-based tools.

Development Support

Microchip also announced the launch of the BM70 Bluetooth Low Energy PICtail™/PICtail Plus daughter board. This new tool can be connected to a PC via a USB interface or to Microchip's existing microcontroller development boards (such as Explorer 16, PIC18 Explorer and PIC32 I/O expansion board) for code development. The BM-70-PICTAIL is available now.

Availability

The IS1870 Bluetooth LE RF IC is available now for sampling and volume production in 1,000-unit quantities in a 48-pin 6x6 mm QFN package. The IS1871 is available in a 32-pin 4x4 mm QFN package and is expected to be available in November in 1,000-unit quantities. The 30-pin BM70 Bluetooth low energy module is available now, with or without an internal PCB antenna. For more information, contact a Microchip sales representative or authorized worldwide distributor, or visit Microchip's website. To purchase products mentioned in this press release, visit microchipDIRECT or contact a Microchip authorized distributor.

About Microchip Technology Inc.

Microchip Technology Inc. (NASDAQ: MCHP) is a leading global supplier of integrated microcontrollers, mixed-signal, analog devices and Flash memory patent solutions, providing low-risk product development, lower system total cost and faster time to market for thousands of consumer products worldwide. Headquartered in Chandler, Arizona, USA, Microchip provides excellent technical support, reliable products and excellent quality.

Note: The Microchip name and logo and PIC are registered trademarks of Microchip Technology Inc. in the U.S. and other countries. PICtail is a trademark of Microchip Technology Inc. in the U.S. and other countries. All other trademarks mentioned herein are property of their respective companies.

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