Foxconn's high-end packaging and testing project settled in Qingdao
Latest update time：2021-08-31 04:51
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On the 15th, Foxconn Technology Group, the mainland subsidiary of Hon Hai Group, signed a "cloud contract" with the West Coast New Area of Qingdao, Shandong Province through a video conference, marking the official establishment of Foxconn's high-end semiconductor packaging and testing project. The project is scheduled to start construction this year, go into production in 2021, and go into mass production in 2025.
Qingdao Daily's WeChat public account Qingbao Guanxiangshan reported that on the Qingdao side, Wang Qingxian, member of the Standing Committee of the Shandong Provincial Party Committee and Secretary of the Qingdao Municipal Party Committee, and others "stood up" for the project signing; on the Foxconn side, Liu Yangwei, chairman of Foxconn Technology Group, and several senior executives witnessed the signing.
Liu Yangwei said that Foxconn's semiconductor high-end packaging and testing project is a core link in the chip design, manufacturing and application industry chain, and plays a leading role in opening up the upstream and downstream industrial chains and accelerating the quality and upgrading of the industry. This project will become an indispensable and important part of new infrastructure such as 5G communications, industrial Internet, and artificial intelligence, laying a solid foundation for the vigorous development of new infrastructure.
Liu Yangwei also added that this is just the beginning. Foxconn will work with Qingdao to promote the development of the industrial chain and high-end technological innovation, cooperate to promote the construction of future cities, allow more future industries to be established in Qingdao, create a new industrial ecology, and contribute to Qingdao's cultivation of electronic information industry clusters and the development of the industrial Internet.
Qilu Evening News reported that Foxconn Semiconductor High-end Packaging and Testing Project, jointly invested by Foxconn Technology Group and Fusion Holdings Group Co., Ltd., will use the world's leading high-end packaging technology to package application chips such as 5G communications and artificial intelligence, which are currently in rapidly growing demand.
The report pointed out that the establishment of Foxconn's high-end semiconductor packaging and testing project will expand the integrated circuit industry chain in Qingdao West Coast New Area, promote the transformation and upgrading of the integrated circuit industry in the new area and even Qingdao City, and help the high-quality development of the economy and society.
Looking back at Hon Hai Group's layout in the semiconductor industry, in August 2018, Foxconn reached an agreement with the Zhuhai government to start the construction of a 12-inch wafer factory in Zhuhai in 2020, with a total investment of US$9 billion.
In September 2018, Foxconn established cooperation with the Jinan Municipal Government and set up a RMB 3.75 billion investment fund to support the development of Shandong's local semiconductor industry. According to the agreement, Foxconn will use its own resources to facilitate the establishment of five IC design companies and one high-power chip company in Jinan.
In November 2018, Foxconn's Jingding Precision Nanjing Semiconductor Industrial Base and Semiconductor Equipment Manufacturing Project was officially signed, with an investment of RMB 2 billion, mainly focusing on high-end semiconductor equipment. Other Taiwanese semiconductor companies such as TSMC and ASE are also located in the Nanjing Pukou Economic Development Zone.
In March 2019, Foxconn Group's subsidiary, semiconductor equipment manufacturer Peixin Energy Technology Co., Ltd. broke ground on a new factory in Nanjing.
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