Industry Conference | Limited Registration! Don’t Miss the 2nd Artificial Intelligence and Semiconductor Technology Forum

On March 21, 2019, the "2019 (Second) Artificial Intelligence and Semiconductor Technology Forum" co-organized by the Integrated Circuit Design Industry Technology Innovation Strategic Alliance, the Integrated Circuit Design Branch of the China Semiconductor Industry Association, and "China Integrated Circuit" magazine, and co-organized by Shanghai Xinmei Conference and Moore Core Ball-"Semiconductor Industry Observer" will be held at the Evergreen Laurel Hotel in Shanghai.

The forum is themed "AI 'core' era, creating an intelligent future", and will deeply explore the application of AI chip industry in smart home, security, autonomous driving and other fields. At the same time, it will deeply analyze how artificial intelligence will build a shared intelligent ecosystem with mobile Internet, Internet of Things and big data in the future. Invite industry leaders to have high-end dialogue: AI gives integrated circuits "core" opportunities.

organizer:

Integrated Circuit Design Industry Technology Innovation Strategic Alliance

China Semiconductor Industry Association Integrated Circuit Design Branch

China Integrated Circuit Magazine

organizer:

Shanghai Xinmei Conference Service Co., Ltd.

Semiconductor Industry Observer

Moore Core Ball

1. Summit Forum

• Artificial Intelligence Chips and Product Trends

• AI chip challenges and implementation

• AI and 5G

• Artificial Intelligence and Intelligent Driving

• Current status and market analysis of artificial intelligence industry

2. Technical topics

• Artificial intelligence new technology products and applications

• AI chip design and verification

• AI Algorithms

• Artificial intelligence chips and their architecture

• Chip manufacturing, packaging and testing technologies for AI

• AI Machine Vision

• Artificial Intelligence Software/Hardware Solutions and Applications

• Opportunities and Challenges of FPGA in the Wave of Artificial Intelligence

• Storage technology accelerates the development of artificial intelligence

• Opportunities brought by RISC-V to artificial intelligence chips

3. High-level dialogue: AI brings opportunities to integrated circuits

4. Product Display

Scan and register to receive:

① Opportunity to attend the conference, limited to 500 places

②Semiconductor industry directory

③Guest public speech PPT

Director of the Department of Micro-Nano Electronics and the Director of the Institute of Microelectronics at Tsinghua University; Chief Technical Engineer of the National Science and Technology Major Project of "Core High-tech Basics"; Convener of the Microelectronics and Optoelectronics Theme of the 863 Plan. Vice Chairman of the China Semiconductor Industry Association, Chairman of the Integrated Circuit Design Branch of the China Semiconductor Industry Association; Chairman of the Integrated Circuit Design Industry Technology Innovation Strategic Alliance; Fellow of the Chinese Institute of Electronics.

Dr. Weimin Dai founded VeriSilicon in August 2001 and has served as the company's chairman, president and CEO. Prior to that, he served as chairman and chief technology officer of Celestry (acquired by Cadence in 2002) and was also the founder, chairman and president of Ultima, one of Celestry's predecessors.

Dr. Dai is the founding chairman of the IEEE International Conference on Multi-Chip Modules, the founding chairman of the IEEE Seminar on Integrated Design of Chip Packages, and the co-chair of the Program Committee of the 2010 International Green Energy Forum. He has served as an associate editor of the IEEE Circuits and Systems and VLSI Systems journals, and has published more than 100 papers in various technical journals and conferences. He was awarded the U.S. Presidential Young Investigator Award in 1990. Dr. Dai was awarded the title of "Top 10 Entrepreneurs in China" in 2005, and was elected as one of the "Top 10 Science and Technology Talents in China in 2005". In 2007, he won the Ernst & Young Entrepreneur Award. In 2013, he was awarded the Best Manager of the Year Award of the 2013 China Annual Electronics Achievement Award, and in 2014, he was awarded the Hurun Report 2014 China Annual Industry Contribution Award. In 2018, he was awarded the Asia-Pacific Innovation Person of the Year Award of the 2018 Global Electronics Achievement Award. Currently, Dr. Dai serves as the executive vice president of the International Alliance of Innovative Technologies, vice president of the Integrated Circuit Design Branch of the China Semiconductor Industry Association, president of the China RISC-V Industry Alliance, member of the Expert Committee of the Automotive Electronics Industry Alliance, president of the Integrated Circuit Branch of the Shanghai Jiao Tong University Alumni Association, and president of the Shanghai Alumni Association of the University of California, Berkeley.

Dr. Dai received his bachelor’s degree in computer science and his Ph.D. in electrical engineering from the University of California, Berkeley, and was a tenured professor in the Department of Computer Engineering at the University of California, Santa Cruz.

Maria Tang is the Vice President of Sales for Greater China at Xilinx. She is responsible for leading a large team of sales, marketing, technology and distribution partners in mainland China, Hong Kong and Taiwan, formulating and driving regional business development strategies, and making outstanding contributions to Greater China, Xilinx's fastest growing global business region.

Speech Topic: Xilinx Adaptive Platform – The Cornerstone of All-Round Innovation

Report Summary:

Share Xilinx's strategies in data center, artificial intelligence, and innovation, as well as new products and roadmaps to meet adaptive computing needs.

Zhang Yundong, co-founder of Vimicro, expert in Chinese neural network processors, and chairman and CEO of Beijing Vimicro Artificial Intelligence Chip Technology Co., Ltd. He started a business in Silicon Valley in the United States in his early years and returned to China. He is the first high-end leader of Zhongguancun, winner of the first prize of the National Science and Technology Progress Award, deputy commander-in-chief of the "Starlight China Chip Project", and executive director of the "National Key Laboratory of Digital Multimedia Chip Technology". He presided over and participated in the formulation of 2 national standards and served as the person in charge of major scientific research projects such as the "Core High-tech Basics", "973 Program", "863 Program", National Electronic Development Fund, and National Integrated Circuit Design Special Project.

Speech topic: Artificial Intelligence Chips in the Internet of Things Era

Report Summary:

Overview and expectations of IC industry development; AI technology in the era of the Internet of Things; the Intelligent Moore's Law of AI chips; Starlight chips promote the application of the Internet of Things.

Graduated from the University of Science and Technology of China in 2005 with a master's degree in intelligent systems. Joined NVIDIA in 2006, and his work areas include smartphones, tablets, smart cities, and driverless cars. The software solution team he led helped NVIDIA products land in China. Zhuo Rui has rich experience and accumulation in the fields of embedded system architecture/software and deep learning.

Speech topic: Application of artificial intelligence in the field of autonomous driving

Report Summary:

Introducing NVIDIA's SoC solution and how to use deep learning to solve autonomous driving problems.

Dr. Wang Donghua is currently responsible for the strategic planning and implementation of artificial intelligence in Intel China. He has held various positions, including the head of the Intel Internet of Things Division's Smart Retail Business Group (Retail Sector) in China and the strategic business development manager of Intel's Digital Home Division. Prior to joining Intel, Dr. Wang Donghua worked at UTStarcom. He received an excellent MBA from the University of Hong Kong in 2012, a Ph.D. in Engineering from Shanghai Jiaotong University in 2004, and a master's and bachelor's degree in engineering from Harbin Institute of Technology in 2001 and 1999.

Speech topic: The era of intelligence starts with the “core”

Report Summary:

Introducing AI market trends, sharing Intel's latest AI progress and products, and summarizing opportunities and challenges

Li Kai is a high-speed test technology expert with nearly 20 years of experience in the communications and electronic measurement industry. He is currently the head of cloud computing and AI technology for Keysight Greater China. He has written monographs such as "Principles of High-Speed ​​Digital Interfaces" (Tsinghua University Press, 2014) and "Advanced Applications of Modern Oscilloscopes" (Tsinghua University Press, 2017). He has also published a large number of articles on the principles and methods of high-speed signal measurement in magazines such as "Foreign Electronic Measurement Technology" and "Electronic Technology Applications" and his personal technical blog. Li Kai graduated from Beijing Institute of Technology in 2001 with a master's degree in optoelectronic engineering. He is a senior member of the Chinese Institute of Electronics, a member of the ODCC Open Data Center Association, and a member of the IMT-2020 5G OTN organization.

Speech Topic: Testing Challenges of High-Performance AI Chips

Report Summary:

AI chips are the core technology for AI technology. Among them, chips for cloud training require massive amounts of data to train their deep neural network models, and have the most stringent performance requirements. High-performance AI chips have completely different requirements from traditional chips for architecture, memory bandwidth, interconnection bandwidth, simulation analysis, and semiconductor manufacturing. This article will systematically introduce Keysight's simulation analysis, CCIX, PCIe4/5, DDR4/5, 100G/400G interconnection and other test solutions for high-performance AI chip interfaces.

He has served as a researcher at Lucent Technologies Bell Labs, head of mobile multimedia at Qualcomm R&D Center, head of OS business planning at Alibaba, and head of product marketing for Qualcomm China's AI business.

Speech topic: 5G adds wings to artificial intelligence

Report Summary:

Mobile AI software and hardware technology and methodology innovation; 5G technology evolution; 5G and AI create an Internet of Everything ecosystem.

Moore Elite is a leading chip design accelerator with the vision of "making it easy to make chips in China". Its main businesses include "chip design services, supply chain operation services, talent services, and enterprise services". It covers more than 1,500 companies and 500,000 engineers in the industry chain. It currently has 240 employees and is growing rapidly.

Before founding Moore Elite, Zhang Jingyang served as the business director of Shanghai Institute of Microelectronics Technology, responsible for government, industry relations and strategic cooperation. Previously, Zhang Jingyang was a senior manager of SEMI (Semiconductor Equipment and Materials Association), responsible for semiconductor business strategic cooperation, standards, and consulting services. Zhang Jingyang also worked at IBM, serving as the head of business development for IBM Microelectronics China, the head of IBM Microelectronics Asia Technical Support Center, and a senior engineer at the chip R&D center. Zhang Jingyang studied in the Department of Radio at Southeast University and obtained a master's and bachelor's degree.

Mr. Yu Dejun graduated from the University of Electronic Science and Technology of China with a major in Microelectronics and Solid-state Electronics and a Ph.D. in Large-Scale Integrated Circuits and Systems. He is a senior expert in mixed-signal integrated circuits and has been engaged in the field of integrated circuits for 14 years. He is familiar with the development of digital and mixed-analog integrated circuits and has rich experience in chip packaging, testing, reliability and failure analysis. He has rich experience in the chip industry and channels. He has profound experience in the fields of analog integrated circuits and mixed-analog integrated circuits. He is the inventor of the first adaptive light engine chip technology in China and the inventor of the first 1/64 scanning LED display driver and intelligent control chip technology in China. He has more than 20 authorized patents and has published more than ten SCI and famous international conference papers.

Speech topic: Positioning exploration and application analysis of AI chip development

Report Summary:

This paper discusses the evolution and progress of AI ASIC chips, explains and analyzes the functions and architecture of artificial intelligence chip development, and analyzes the current application trends of AI chips in vertical fields, as well as the key points and difficulties, in combination with application scenarios.

In 2003, he joined Advantest Beijing Testing Technology Department and was responsible for leading the northern region testing technology team of Advantest to provide customers with application development, pre-sales and after-sales technical support. With years of work experience, he participated in the introduction and promotion of a large number of new solutions and new products of Advantest, and participated in the development of customized testing solutions to reduce testing costs. In the past two years, he has mainly focused on the promotion of mining machine ASIC chips, HPC chips, and AI chip testing solutions and the implementation of customer projects.

Speech topic: Advantest's comprehensive solutions for AI & HPC chip testing needs

Report Summary:

Our society is facing digital transformation. The massive amount of data generated makes artificial intelligence and high-performance computing chips play an increasingly important role in processing this data. These high-performance chips use more advanced process nodes, more groundbreaking chip architectures, and more challenging packaging types. Testing faces unprecedented challenges. Using Advantest's comprehensive test solutions based on V93000 can more easily meet the above needs.

Shan Guo has been working as a FAE and AE engineer at CEVA for seven years. She is mainly responsible for technical support of AI and CV product lines and works closely with customers in China and the United States. Previously, she worked as a DSP engineer at Changhong for six years, developing video codec and CV application solutions based on CEVA DSP. She holds a master's degree in communications and information systems and a bachelor's degree in electronic engineering from Beijing Institute of Technology.

Speech topic: Artificial Intelligence - From publicity hotspot to production, generating high value

Scan and register to receive:

① Opportunity to attend the conference, limited to 500 places

②Semiconductor industry directory

③Guest public speech PPT

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