Article count:25239 Read by:103424336

Account Entry

Qualcomm Wi-Fi chip integrates UWB, what should other manufacturers do?

Latest update time:2024-02-27
    Reads:

????If you want to see each other often, please mark it as a star???? and add it to your collection~


Source : Content from Semiconductor Industry Observation (ID: i c bank ) Comprehensive , thank you.


Qualcomm just announced the X80 modem at MWC 2024, but it has more up its sleeves when it launches the FastConnect 7900 connectivity kit.


This is the latest generation of branded wireless connectivity suite the company has seen in its high-end mobile chipsets, and we expect it to provide support for non-cellular connectivity in the Snapdragon 8 Gen 4 processor.


Qualcomm said that this 6nm chip is the first chip to integrate Wi-Fi, Bluetooth and UWB connection functions, eliminating the need for a separate chip to implement UWB. Does this mean any phone using a Snapdragon processor with FastConnect 7900 will support UWB? Or will smartphone manufacturers still need to implement additional hardware?


"Yes, UWB is fully integrated as a single-chip solution," Qualcomm told us in response to an email query.


We also asked the company whether Android OEMs would need to pay a licensing fee to use the integrated UWB solution, but the company reiterated that "all features and functionality are provided as a single-chip solution."


Still, Qualcomm added during the media briefing that this integrated approach frees up space that could be used for a larger battery or something else.


Still, integrating UWB hardware is a big deal, as the technology has traditionally been limited to higher-end flagship phones. For example, the Galaxy S24 lacks UWB, while the S24 Plus and S24 Ultra offer it. UWB is used for more precise object lookup (such as tracker tags), digital car keys, and improved smart home control.


Artificial intelligence makes an appearance here, too, with Qualcomm claiming it's the first "AI-enhanced Wi-Fi system." The chipmaker says it's using artificial intelligence to understand what you're doing and make relevant adjustments (such as minimizing latency during video calls). Either way, power consumption is expected to be 30% lower compared to the FastConnect 7800 kit inside the Snapdragon 8 Gen 3, the company says.


In addition, the FastConnect 7900 platform supports Wi-Fi high-band synchronization (such as Snapdragon Seamless) for multi-device functionality as well as the company's XPAN technology for audio transmission over Wi-Fi.


The FastConnect 7900 is expected to launch in devices later this year, ostensibly inside a Snapdragon 8 Gen 4 processor.


In the past few years, driven by Apple, UWB has become popular around the world, but the launch of UWB-integrated chips by giants like Qualcomm will undoubtedly have an impact on third-party UWB chip suppliers.



Samsung also has UWB chips



Samsung Electronics announced the launch of its first ultra-wideband (UWB) chipset, Exynos Connect U100, early last year for mobile, automotive and IoT devices. The South Korean company believes the new hardware solution can provide distance measurement accurate to "single digits centimeters." The company launched the U100 as part of its new Exynos Connect family of short-range wireless solutions, which also covers Bluetooth and Wi-Fi products.


UWB has gained momentum since it was included in the iPhone craze in late 2019. It is based on the IEEE 802.15.4z standard and uses a wide spectrum (500 MHz to several GHz) and high frequency (6.5 GHz to 9 GHz), far away from the busy ISM band 2.4 GHz. It provides low-power short-range positioning ("fine ranging") in three dimensions - typically around 200 meters and a positioning distance of around 10 centimeters.


In addition to locating objects with high accuracy, it can track them using distance measurements between radios and calculate time of arrival (ToA) and angle of arrival (or motion; AoA). Ranging is achieved through time-of-flight (ToF) measurements of radar signals between devices. The FiRa (Fine Ranging) Alliance says UWB is "significantly ahead" of other short-range technologies in terms of accuracy, reliability and power consumption.


Samsung says the new U100 offers "single-digit centimeter accuracy, below five degrees." It noted that its location accuracy is useful when tracking locations in challenging indoor environments, such as warehouses and factories where GPS is not available. It is also useful when running applications that require accurate real-time tracking of moving people and objects, such as AR and VR services, as well as direct asset tracking.


It noted that it is increasingly popular in remote payment and smart key solutions, as well as smart homes and smart factories. The U100 complies with the Car Connectivity Consortium's (CCC) Digital Key standard, so UWB-enabled smartphones can securely exchange information with the vehicle. A power save mode in the U100 enables it to track tags running on limited battery; it is also equipped with a Scrambled Timestamp Sequence (STS) function and a secure hardware encryption engine to protect against external hacker attacks.


The U100 integrates radio frequency (RF), baseband, embedded flash (eFlash) memory and power management IP into a single chip, which is useful for compact devices. The U100 is certified by the FiRa Alliance; Samsung is a founding member of the organization, which also includes Apple, Bosch, Cisco, Google, HID, NXP, Qualcomm and Thales. It is worth noting that NXP and STMicroelectronics are the pioneers of UWB chips.


Joonsuk Kim, executive vice president of Samsung's Connectivity Development Team, said: "Our Exynos Connect U100 combines advanced ranging and positioning capabilities with strong security to enable hyperconnectivity between people and everyday objects, advancing the field of location and positioning A range of new applications. Location tracking... We are committed to driving innovation in short-range communications solutions.”


Original link

https://www.androidauthority.com/qualcomm-fastconnect-7900-uwb-3417980/


Click here to follow and lock in more original content

END


*Disclaimer: This article is original by the author. The content of the article is the personal opinion of the author. The reprinting by Semiconductor Industry Watch is only to convey a different point of view. It does not mean that Semiconductor Industry Watch agrees or supports the view. If you have any objections, please contact Semiconductor Industry Watch.


Today is the 3688th issue of "Semiconductor Industry Observation" shared with you. Welcome to pay attention.


Recommended reading


"Semiconductor's First Vertical Media"

Real-time professional original depth

Public account ID: icbank


If you like our content, click "Watching" to share it with your friends.

 
EEWorld WeChat Subscription

 
EEWorld WeChat Service Number

 
AutoDevelopers

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Room 1530, Zhongguancun MOOC Times Building,Block B, 18 Zhongguancun Street, Haidian District,Beijing, China Tel:(010)82350740 Postcode:100190

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号