Article count:25239 Read by:103424336

Account Entry

Marvell reveals next-generation silicon photonics platform

Latest update time:2023-12-06
    Reads:
Source: The content is compiled from servethehome by Semiconductor Industry Observer (ID: ic bank ) , thank you.

Marvell demonstrated its next-generation silicon photonics platform at the 2023 Marvell Analyst Day. We're finally seeing the company's progress toward packaged silicon photonics devices designed to dramatically increase I/O capacity and reach in future generations of products.


Marvell Silicon Photonics


Most of Marvell's silicon photonics IP comes from its acquisition of Inphi. Inphi built COLORZ 100, a 100G ZR fiber used to connect Microsoft data center campuses.



COLORZ 400 was released in 2020 and will enter production in the second half of 2021. Hundreds of thousands of pluggable modules have been deployed. COLORZ 800 is an 800G single wavelength optical module. This combines the company's 800G silicon photonics solutions with our previously introduced 800G Orion coherent DSP.


The company has a path to quadruple module speeds, from 800G, which is a hot topic today, to 3.2T using 16-channel silicon photonics technology.



Now, Marvell is starting to talk about its light engine, too.



Marvell has been working on integrating silicon photonics into packaging for some time. This is an important technology that we have discussed for years because it will allow for technologies such as remote memory (increased capacity), faster chip-to-chip interconnects, and a wider range of devices in the system to reside on. On the network switch side, it's much more efficient than driving signals from the switch package through the PCB to a pluggable optical cage. This co-packaging typically requires technologies such as TSV to drill through silicon components, but this is a set of technologies that our industry as a whole needs.



What we should note here is that Marvell is demonstrating laser integration on the package. We've discussed this a few times, but the laser is typically the least reliable component in an optical module, so moving it out of the package and into a pluggable module turns it into a service item. With chips costing tens of thousands of dollars, improving reliability is important.


At its 2023 Analyst Day, Marvell showed off its new SiPho light engine for AI. This is the company's new 200G per channel silicon photonics light engine. It integrates hundreds of components into the engine.



Perhaps the biggest claim is that it will deliver Tbps performance at less than 10 picojoules per bit. This is an important target efficiency metric in the industry. The light engine can then be used as a pluggable optical module or a co-packaged optical solution.


Marvell said the light engine has been tape-out and is about to undergo live demonstrations. Marvell said it plans to sell it as a light engine rather than a pluggable module for data centers. Others will assemble it into pluggable modules. It could also co-package the light engine in a switch or another chip.


This will be the next generation of battlefield technology as the industry strives to create larger, more efficient packages to improve performance while addressing power consumption challenges.


Original link

https://www.servethehome.com/marvell-silicon-photonics-light-engine-for-ai-marvell-analyst-day-2023/


*Disclaimer: This article is original by the author. The content of the article is the personal opinion of the author. The reprinting by Semiconductor Industry Watch is only to convey a different point of view. It does not mean that Semiconductor Industry Watch agrees or supports the view. If you have any objections, please contact Semiconductor Industry Watch.


Today is the 3606th issue shared by "Semiconductor Industry Observation" with you. Welcome to pay attention.

Recommended reading


Semiconductor Industry Watch

" Semiconductor's First Vertical Media "

Real-time professional original depth


Identify the QR code , reply to the keywords below, and read more

Wafers | Integrated circuits | Equipment | Automotive chips | Storage | TSMC | AI | Packaging

Reply Submit an article and read "How to Become a Member of "Semiconductor Industry Watch""

Reply Search and you can easily find other articles you are interested in!

 
EEWorld WeChat Subscription

 
EEWorld WeChat Service Number

 
AutoDevelopers

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Room 1530, Zhongguancun MOOC Times Building,Block B, 18 Zhongguancun Street, Haidian District,Beijing, China Tel:(010)82350740 Postcode:100190

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号