ISSCC 2022: 30 papers from mainland China, Hong Kong and Macao were selected, a record high
Latest update time：2021-11-24 10:26
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ISSCC stands for International Solid-State Circuits Conference. It was founded in 1953. With more than 60 years of history, it has become the largest, most authoritative and highest-level international solid-state circuit conference in the world. ISSCC has always been the flagship conference of the IEEE Solid-State Circuits Society and is even known as the Semiconductor Olympics.
近年来，随着我国在科研上的持续投入，我国的ISSCC论文入选方面也有了显著提升。据ISSCC国际技术委员会远东区秘书罗文基副教授介绍，今年，ISSCC共收到651篇，创新高，200篇入选，收录率达30.7%，比去年稍微降低。
Associate Professor Luo Wenqi further pointed out that there are a total of 12 technical categories in the ISSCC 2022 papers. In terms of proportion, the technical directions, radio frequency circuits, machine learning and other fields are relatively stable, but the proportion of papers on wired transmission is still small, and there has been a significant increase in memory.
Judging from the regional distribution and trends of the selected papers, they are mainly distributed in Europe, North America and the Far East. Among them, a total of 99 papers were selected from the Far East this year, which has a significant increase over last year and has occupied an important position among the three regions.
In terms of country and region distribution, this year's selected papers involve 19 countries and regions around the world.
Judging from the distribution of enterprises and universities, 2/3 of the selected papers are from universities, 69 of which are from universities in the Far East region, and the remaining 30 are from enterprises and research institutes.
Although the number of selected papers from the United States this year has decreased compared with previous years, it is still a very strong competitor, with a total of 69 papers selected. The number of selected papers from South Korea, mainland China, Hong Kong and Macao has increased significantly, and Taiwan also has 15 papers selected. The number of selected papers from Japan has also decreased compared with previous years, with only 7 papers selected.
This year, more than 75% of the papers in the Far East region were selected, significantly more than those in the North America region. The dominant areas include memory, image sensors, neural interfaces, and processors for specific fields.
Professor Luo Wenqi also mentioned that the paper written by Professor Xu Jiawei’s team from Fudan University won this year’s Silk Road Award.
At the meeting, Associate Professor Lu Yan, the representative of the ISSCC International Technical Committee in China, introduced the selected papers and development trends in China this year. Specifically, a total of 30 papers from mainland China, Hong Kong and Macao were selected this year.
Judging from the trend of selected papers, the number of mainland articles included continues to rise, and the number of technical fields covered has increased again. Tsinghua University has 9 selected papers, Peking University has 5 selected papers, the University of Macau has 4 selected papers, Zhejiang University and Fudan University have 3 selected papers each, the University of Science and Technology of China has 2 selected papers, and Tianjin University and the University of Electronic Science and Technology of China have 1 selected paper. In addition, NewRice Technology is the only selected company, with 1 selected paper.
Associate Professor Lu Yan also introduced the trends of the selected papers. This year, the 30 selected papers are distributed in 11 areas, with power management, radio frequency circuits, and machine learning being strong directions. Associate Professor Lu Yan expressed the hope that companies can publish more papers. In the field of analog circuits, companies in Japan, South Korea, and North America have published papers.
The following is a brief introduction to the included papers from mainland China, Hong Kong and Macao:
Next, Professor Geng Li from Xi'an Jiaotong University introduced the highlight papers and trends of memory:
In general, in terms of memory, the Far East dominated the list with 19 papers selected, accounting for 90%. Among them, South Korea was the most outstanding with 11 papers selected, Taiwan had 6 papers selected, and Peking University had 2 papers selected. This year, there were three sessions of focus, including NAND flash memory, in-memory computing, and DRAM and Interface.
Among them, there are 5 papers on NAND flash memory, among which the highlight paper comes from Western Digital. The technical highlights are as follows:
In terms of in-memory computing, a total of 8 papers were selected, among which the highlight papers came from SK Hynix and TSMC. The specific technical highlights are as follows:
In addition, two papers from my country were selected, both from Peking University.
In terms of DRAM and Interface, a total of 8 papers were selected, and the highlight papers came from SK Hynix and Samsung. The specific technical highlights are as follows:
In Professor Geng Li's view, in the future, in order to meet the growing storage performance requirements of various applications, from graphics and mobile devices to supercomputing, DRAM will continue to expand density and data bandwidth. At the same time, a large amount of research continues on emerging memories to find alternatives to floating gate-based non-volatile memories to achieve high storage capacity, high cycle capacity, and lower power consumption per bit read/write operations. She introduced that NAND flash memory continues to develop in the direction of higher density, lower power consumption and higher performance.
Next, Professor Yu Jie from the Hong Kong University of Science and Technology introduced the situation in the field of wired communications.
According to him, this year this field received a total of 39 submissions, 14 were accepted, and the paper inclusion rate was 35.9%. The two sessions were mainly Ultra High-Speed Wireline and Advanced Wireline Links and Techniques.
Among them, in the field of Ultra High-Speed Wireline, a total of 7 papers were selected, 5 from North America and 2 from the Far East. The highlight papers are introduced as follows:
In the Advanced Wireline Links and Techniques area, there are 7 papers, 6 from North America and 1 from the Far East. The highlights are as follows:
Professor Yu Jie also introduced the future trends of wired communications, as follows:
Next, Professor Liu Yongpan of Tsinghua University introduced the status of papers on machine learning and artificial intelligence. This year, 13 papers on machine learning were selected, including 7 from the Far East, 4 from North America, and 2 from Europe. They mainly involved two sessions, ML Processors and ML Chips for Emerging Applications, and also involved three related sessions, Highlighted Chip Releases: Digital/ML, Processors, Compute-in-Memory.
The trend of paper submissions is as follows. Professor Liu Yongpan said that as the technology becomes more mature, the number of submissions has a downward trend.
The two sessions are distributed as follows:
From mainland China, one article was selected from Fudan University, and the other three were from Tsinghua University.
The highlights of ML Processors are as follows:
The highlight papers of ML Chips for Emerging Applications are as follows:
In the view of Professor Liu Yongpan, machine learning has shifted from a low-level benchmark to a system level benchmark.
Next, Professor Xu Jiawei from Fudan University introduced the papers on imaging, MEMS, medical treatment and display.
This year, there are 69 submissions in this field, and 22 papers are included, with an inclusion rate of 31.9%. It involves three sessions: Imagers, Range Sensors and Displays; Body and Brain Interfaces, and Ultrasound and Beamforming Applications. The specific distribution is as follows:
Imagers, Range Sensors and Displays highlight papers are from Canon and Samsung. The highlights are as follows:
In terms of Body and Brain Interfaces, the highlight papers come from Fudan University and Cornell University. The technical highlights are as follows:
In Ultrasound and Beamforming Applications, the highlight papers come from NUS and TU Delft. The highlights are as follows:
Next, Associate Professor Luo Wenji from the University of Macau introduced the status of papers on analog circuits. This year, a total of 42 papers were submitted, 12 of which were included, covering two sessions: Analog Techniques & Sensor Interface and Audio Amplifiers.
The highlight papers are introduced as follows:
Associate Professor Luo Wenji said that the future development trends of Class-D Audio Amplifiers are as follows:
Then, Associate Professor Zhu Yan from the University of Macau introduced the papers on data converters, mainly involving two sessions: Nyquist and Incremental ADCs and Noise-shaping ADCs.
In terms of Nyquist and Incremental ADCs, the highlight papers are as follows:
In terms of noise-shaping ADCs, the highlight papers are as follows:
Next, Assistant Professor Liu Xun from the Chinese University of Hong Kong (Shenzhen) introduced the situation in power management. This year, there were 81 papers submitted, 20 of which were included, with an inclusion rate of 24.7%. Among them, there were 11 papers from the Far East, 1 from Europe, and 8 from North America. The three sessions involved were GAN, High-Voltage and Wireless Power; DC-DC Converters; Power Management Techniques.
In terms of GAN, High-Voltage and Wireless Power, the highlight article comes from National Chiao Tung University in Taiwan. The technical highlights are as follows:
In terms of DC-DC Converters, the highlight article comes from Zhejiang University.
In terms of Power Management Techniques, the highlight article comes from Samsung.
Next, Professor Xu Hongtao of Fudan University introduced the situation in the field of wireless communications. This year, a total of 20 papers were accepted, with an acceptance rate of 31.7%. There were 9 papers from the Far East and North America, and 2 papers from Europe. The three sessions involved were mm-Wave and subTHz ICs for Communication and Sensing; Low power consumption and UWB; Wave and millimeter wave applications in 5G.
In the area of mm-Wave and subTHz ICs for Communication and Sensing, the highlights are from Intel and MIT, as follows:
In terms of low power consumption and UWB, the highlights of the articles come from the Belgian Microelectronics Research Center and the University of Macau. The highlights are as follows:
In terms of the application of Wave and millimeter wave in 5G, the highlight articles come from Tokyo Institute of Technology and Samsung Electronics. The highlights are as follows:
Regarding future trends, Professor Xu Hongtao said that communication performance is related to quantity and bandwidth, and only when the performance is improved by an order of magnitude will it be beneficial to the development of the entire industry.
Afterwards, Associate Professor Deng Wei from Tsinghua University introduced the selected papers on radio frequency circuits.
According to reports, a total of 68 papers were submitted this year, 21 of which were included, with an inclusion rate of 31%, covering four sessions: Advanced RF Building Blocks; High Quality GHz-to-THz Reference Generation and Radiation; Power Amplifiers and Building Blocks, and Frequency Synthesizers.
The highlights of the papers are as follows:
Next, Associate Professor Yin Jun from the University of Macau introduced the status of digital architecture and system papers. This year, 48 papers were submitted and 15 were included, an increase of 45.5% over last year, with an inclusion rate of 31.3%. The specific distribution is as follows:
The highlight papers are introduced as follows:
In terms of processors, Associate Professor Yin Jun believes that as the size of bumps and through-silicon-vias continues to shrink, the data transmission bandwidth between multiple chips is increasing rapidly.
Finally, Associate Professor Lu Yan from the University of Macau introduced the status of digital circuit papers. 64 papers were submitted, 15 were included, and the inclusion rate was 32.6%. The specific distribution is as follows:
The highlight papers are introduced as follows:
The development trends are as follows:
*Disclaimer: This article is originally written by the author. The content of the article is the author's personal opinion. Semiconductor Industry Observer reprints it only to convey a different point of view. It does not mean that Semiconductor Industry Observer agrees or supports this point of view. If you have any objections, please contact Semiconductor Industry Observer.
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