Win a prize by passing the level! Micron ships 232-layer NAND, expanding the boundaries of 3D NAND technology

High Performance: Micron’s 232-layer NAND has the industry’s fastest NAND input/output (I/O) speed (2.4 GB per second) to meet the needs of low latency and high throughput for data-intensive workloads such as artificial intelligence, unstructured databases, real-time analytics and cloud computing.

Data Density: Micron's 232-layer high-density NAND allows customers to design flexibly, achieving TLC densities up to 14.6 Gb per square millimeter. Areal density is 35% to 100% higher than competing TLC products on the market today.

Applications everywhere: More storage capacity – Increase stacking layers to increase storage capacity to 1 Tb per die, 2 TB per package – From the intelligent edge to cloud computing, Micron’s 232-layer NAND delivers more devices More storage to help enable smarter, more powerful devices.