64M bits SDRAM (2M words x 32 bits)
| EDS6432CFBH | EDS6432AFBH-6B-E | EDS6432AFBH | EDS6432AFBH-75-E | EDS6432CFBH-75-E | |
|---|---|---|---|---|---|
| Description | 64M bits SDRAM (2M words x 32 bits) | 64M bits SDRAM (2M words x 32 bits) | 64M bits SDRAM (2M words x 32 bits) | 64M bits SDRAM (2M words x 32 bits) | 64M bits SDRAM (2M words x 32 bits) |
| Is it Rohs certified? | - | conform to | - | conform to | conform to |
| Maker | - | ELPIDA | - | ELPIDA | ELPIDA |
| Parts packaging code | - | BGA | - | BGA | BGA |
| package instruction | - | TFBGA, BGA90,9X15,32 | - | TFBGA, BGA90,9X15,32 | TFBGA, BGA90,9X15,32 |
| Contacts | - | 90 | - | 90 | 90 |
| Reach Compliance Code | - | unknow | - | unknow | unknow |
| ECCN code | - | EAR99 | - | EAR99 | EAR99 |
| access mode | - | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| Maximum access time | - | 5.4 ns | - | 5.4 ns | 5.4 ns |
| Other features | - | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | - | 166 MHz | - | 133 MHz | 133 MHz |
| I/O type | - | COMMON | - | COMMON | COMMON |
| interleaved burst length | - | 1,2,4,8 | - | 1,2,4,8 | 1,2,4,8 |
| JESD-30 code | - | R-PBGA-B90 | - | R-PBGA-B90 | R-PBGA-B90 |
| length | - | 13 mm | - | 13 mm | 13 mm |
| memory density | - | 67108864 bi | - | 67108864 bi | 67108864 bi |
| Memory IC Type | - | SYNCHRONOUS DRAM | - | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| memory width | - | 32 | - | 32 | 32 |
| Number of functions | - | 1 | - | 1 | 1 |
| Number of ports | - | 1 | - | 1 | 1 |
| Number of terminals | - | 90 | - | 90 | 90 |
| word count | - | 2097152 words | - | 2097152 words | 2097152 words |
| character code | - | 2000000 | - | 2000000 | 2000000 |
| Operating mode | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | - | 70 °C | 70 °C |
| organize | - | 2MX32 | - | 2MX32 | 2MX32 |
| Output characteristics | - | 3-STATE | - | 3-STATE | 3-STATE |
| Package body material | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | TFBGA | - | TFBGA | TFBGA |
| Encapsulate equivalent code | - | BGA90,9X15,32 | - | BGA90,9X15,32 | BGA90,9X15,32 |
| Package shape | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | - | GRID ARRAY, THIN PROFILE, FINE PITCH | - | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | - | 260 | - | 260 | 260 |
| power supply | - | 3.3 V | - | 3.3 V | 3.3 V |
| Certification status | - | Not Qualified | - | Not Qualified | Not Qualified |
| refresh cycle | - | 4096 | - | 4096 | 4096 |
| Maximum seat height | - | 1.14 mm | - | 1.14 mm | 1.14 mm |
| self refresh | - | YES | - | YES | YES |
| Continuous burst length | - | 1,2,4,8,FP | - | 1,2,4,8,FP | 1,2,4,8,FP |
| Maximum standby current | - | 0.002 A | - | 0.002 A | 0.002 A |
| Maximum slew rate | - | 0.26 mA | - | 0.22 mA | 0.22 mA |
| Maximum supply voltage (Vsup) | - | 3.6 V | - | 3.6 V | 2.7 V |
| Minimum supply voltage (Vsup) | - | 3 V | - | 3 V | 2.3 V |
| Nominal supply voltage (Vsup) | - | 3.3 V | - | 3.3 V | 2.5 V |
| surface mount | - | YES | - | YES | YES |
| technology | - | CMOS | - | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| Terminal form | - | BALL | - | BALL | BALL |
| Terminal pitch | - | 0.8 mm | - | 0.8 mm | 0.8 mm |
| Terminal location | - | BOTTOM | - | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 8 mm | - | 8 mm | 8 mm |
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