EDS6432CFBH-75-E datasheet, PDF

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EDS6432CFBH-75-E: Description64M bits SDRAM (2M words x 32 bits); Categorystorage storage; File Size600KB，49 Pages; ManufacturerELPIDA; Websitehttp://www.elpida.com/en; Environmental Compliance

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EDS6432CFBH-75-E Overview

64M bits SDRAM (2M words x 32 bits)

EDS6432CFBH-75-E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ELPIDA
Parts packaging code	BGA
package instruction	TFBGA, BGA90,9X15,32
Contacts	90
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PBGA-B90
length	13 mm
memory density	67108864 bi
Memory IC Type	SYNCHRONOUS DRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	90
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA90,9X15,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.14 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.002 A
Maximum slew rate	0.22 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

EDS6432CFBH-75-E Related Products

	EDS6432CFBH-75-E	EDS6432AFBH-6B-E	EDS6432AFBH	EDS6432AFBH-75-E	EDS6432CFBH
Description	64M bits SDRAM (2M words x 32 bits)	64M bits SDRAM (2M words x 32 bits)	64M bits SDRAM (2M words x 32 bits)	64M bits SDRAM (2M words x 32 bits)	64M bits SDRAM (2M words x 32 bits)
Is it Rohs certified?	conform to	conform to	-	conform to	-
Maker	ELPIDA	ELPIDA	-	ELPIDA	-
Parts packaging code	BGA	BGA	-	BGA	-
package instruction	TFBGA, BGA90,9X15,32	TFBGA, BGA90,9X15,32	-	TFBGA, BGA90,9X15,32	-
Contacts	90	90	-	90	-
Reach Compliance Code	unknow	unknow	-	unknow	-
ECCN code	EAR99	EAR99	-	EAR99	-
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	-
Maximum access time	5.4 ns	5.4 ns	-	5.4 ns	-
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	-
Maximum clock frequency (fCLK)	133 MHz	166 MHz	-	133 MHz	-
I/O type	COMMON	COMMON	-	COMMON	-
interleaved burst length	1,2,4,8	1,2,4,8	-	1,2,4,8	-
JESD-30 code	R-PBGA-B90	R-PBGA-B90	-	R-PBGA-B90	-
length	13 mm	13 mm	-	13 mm	-
memory density	67108864 bi	67108864 bi	-	67108864 bi	-
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	-	SYNCHRONOUS DRAM	-
memory width	32	32	-	32	-
Number of functions	1	1	-	1	-
Number of ports	1	1	-	1	-
Number of terminals	90	90	-	90	-
word count	2097152 words	2097152 words	-	2097152 words	-
character code	2000000	2000000	-	2000000	-
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	-
Maximum operating temperature	70 °C	70 °C	-	70 °C	-
organize	2MX32	2MX32	-	2MX32	-
Output characteristics	3-STATE	3-STATE	-	3-STATE	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-
encapsulated code	TFBGA	TFBGA	-	TFBGA	-
Encapsulate equivalent code	BGA90,9X15,32	BGA90,9X15,32	-	BGA90,9X15,32	-
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	-
Peak Reflow Temperature (Celsius)	260	260	-	260	-
power supply	3.3 V	3.3 V	-	3.3 V	-
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-
refresh cycle	4096	4096	-	4096	-
Maximum seat height	1.14 mm	1.14 mm	-	1.14 mm	-
self refresh	YES	YES	-	YES	-
Continuous burst length	1,2,4,8,FP	1,2,4,8,FP	-	1,2,4,8,FP	-
Maximum standby current	0.002 A	0.002 A	-	0.002 A	-
Maximum slew rate	0.22 mA	0.26 mA	-	0.22 mA	-
Maximum supply voltage (Vsup)	2.7 V	3.6 V	-	3.6 V	-
Minimum supply voltage (Vsup)	2.3 V	3 V	-	3 V	-
Nominal supply voltage (Vsup)	2.5 V	3.3 V	-	3.3 V	-
surface mount	YES	YES	-	YES	-
technology	CMOS	CMOS	-	CMOS	-
Temperature level	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	-
Terminal form	BALL	BALL	-	BALL	-
Terminal pitch	0.8 mm	0.8 mm	-	0.8 mm	-
Terminal location	BOTTOM	BOTTOM	-	BOTTOM	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-
width	8 mm	8 mm	-	8 mm	-

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