ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14
Parameter Name | Attribute value |
package instruction | DIP, |
Reach Compliance Code | unknown |
series | ACT |
JESD-30 code | R-GDIP-T14 |
length | 19.43 mm |
Logic integrated circuit type | AND GATE |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
propagation delay (tpd) | 8.6 ns |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
Base Number Matches | 1 |
54ACTQ08DM-MLS | 5962R8954702DA | 54ACTQ08MDA | 5962R8954702CA | 5962R89547022A | 54ACTQ08MDS | |
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Description | ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 | ACT SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, DFP-14 | ACT SERIES, QUAD 2-INPUT AND GATE, UUC14 | ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 | ACT SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20 | ACT SERIES, QUAD 2-INPUT AND GATE, UUC14 |
package instruction | DIP, | DFP, FL14,.3 | DIE, | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | DIE, |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | compliant |
series | ACT | ACT | ACT | ACT | ACT | ACT |
JESD-30 code | R-GDIP-T14 | R-GDFP-F14 | X-XUUC-N14 | R-GDIP-T14 | S-CQCC-N20 | X-XUUC-N14 |
Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
Number of functions | 4 | 4 | 4 | 4 | 4 | 4 |
Number of entries | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 14 | 14 | 14 | 14 | 20 | 14 |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
encapsulated code | DIP | DFP | DIE | DIP | QCCN | DIE |
Package shape | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | SQUARE | UNSPECIFIED |
Package form | IN-LINE | FLATPACK | UNCASED CHIP | IN-LINE | CHIP CARRIER | UNCASED CHIP |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL | UPPER | DUAL | QUAD | UPPER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
Maximum operating temperature | 125 °C | 125 °C | - | 125 °C | 125 °C | - |
Minimum operating temperature | -55 °C | -55 °C | - | -55 °C | -55 °C | - |
propagation delay (tpd) | 8.6 ns | 7.5 ns | - | 7.5 ns | 7.5 ns | - |
Maximum seat height | 5.08 mm | 2.032 mm | - | 5.08 mm | 1.905 mm | - |
Temperature level | MILITARY | MILITARY | - | MILITARY | MILITARY | - |
Terminal pitch | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | - |
width | 7.62 mm | 6.2865 mm | - | 7.62 mm | 8.89 mm | - |
Is it Rohs certified? | - | incompatible | - | incompatible | incompatible | conform to |