ACT SERIES, QUAD 2-INPUT AND GATE, UUC14
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| package instruction | DIE, |
| Reach Compliance Code | compliant |
| series | ACT |
| JESD-30 code | X-XUUC-N14 |
| Logic integrated circuit type | AND GATE |
| Humidity sensitivity level | 1 |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |
| 54ACTQ08MDS | 5962R8954702DA | 54ACTQ08DM-MLS | 54ACTQ08MDA | 5962R8954702CA | 5962R89547022A | |
|---|---|---|---|---|---|---|
| Description | ACT SERIES, QUAD 2-INPUT AND GATE, UUC14 | ACT SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, DFP-14 | ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 | ACT SERIES, QUAD 2-INPUT AND GATE, UUC14 | ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 | ACT SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20 |
| package instruction | DIE, | DFP, FL14,.3 | DIP, | DIE, | DIP, DIP14,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | compliant | unknow | unknown | unknown | unknown | unknown |
| series | ACT | ACT | ACT | ACT | ACT | ACT |
| JESD-30 code | X-XUUC-N14 | R-GDFP-F14 | R-GDIP-T14 | X-XUUC-N14 | R-GDIP-T14 | S-CQCC-N20 |
| Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 20 |
| Package body material | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIE | DFP | DIP | DIE | DIP | QCCN |
| Package shape | UNSPECIFIED | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | SQUARE |
| Package form | UNCASED CHIP | FLATPACK | IN-LINE | UNCASED CHIP | IN-LINE | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal form | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal location | UPPER | DUAL | DUAL | UPPER | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Is it Rohs certified? | conform to | incompatible | - | - | incompatible | incompatible |
| Maximum operating temperature | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | - | -55 °C | -55 °C |
| propagation delay (tpd) | - | 7.5 ns | 8.6 ns | - | 7.5 ns | 7.5 ns |
| Maximum seat height | - | 2.032 mm | 5.08 mm | - | 5.08 mm | 1.905 mm |
| Temperature level | - | MILITARY | MILITARY | - | MILITARY | MILITARY |
| Terminal pitch | - | 1.27 mm | 2.54 mm | - | 2.54 mm | 1.27 mm |
| width | - | 6.2865 mm | 7.62 mm | - | 7.62 mm | 8.89 mm |
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