datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> The resistor> HCHP0505100PPM22.10.5%GR0151E4
PDF
Preview

HCHP0505100PPM22.10.5%GR0151E4

Description
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 22.1ohm, 50V, 0.5% +/-Tol, -100,100ppm/Cel, 0505,
CategoryPassive components    The resistor   
File Size136KB，9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

HCHP0505100PPM22.10.5%GR0151E4 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 22.1ohm, 50V, 0.5% +/-Tol, -100,100ppm/Cel, 0505,

HCHP0505100PPM22.10.5%GR0151E4 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid228248569
Reach Compliance Codecompliant
Country Of OriginFrance
ECCN codeEAR99
YTEOL8.2
structureChip
JESD-609 codee4
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length1.27 mm
Package formSMT
Package width1.27 mm
method of packingWaffle Pack
Rated power dissipation(P)0.125 W
GuidelineMIL-R-55342D
resistance22.1 Ω
Resistor typeFIXED RESISTOR
seriesHCHP
size code0505
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Tolerance0.5%
Operating Voltage50 V

HCHP0505100PPM22.10.5%GR0151E4 Preview

CHP, HCHP
www.vishay.com
Vishay Sfernice
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h) Thick Film Technology
FEATURES
• Robust terminations
• Large ohmic value range 0.1
to 100 M
• Tight tolerance to 0.5 %
• CHP: Standard passivated version for
industrial, professional and military applications
• HCHP: For high frequency applications
• ESCC approved see CHPHR
• High temperature (245 °C) see CHPHT
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at + 70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform to specifications NFC 83-240 and
MIL-R-55342 D.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
Sputtered Thin Film terminations, with nickel barrier, are
very convenient for high operating conditions. They can
withstand thousands of very severe thermal shocks.
B (W/A), N (W/A), and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
• SMD wraparound chip resistor
• Halogen-free according to IEC 61249-2-21 definition
• Withstand moisture resistance test of AEC-Q200
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
Lead (Pb)-containing terminations are not RoHS-compliant.
Exemptions may apply.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CHP0502
HCHP0502
CHP0505
HCHP0505
CHP0603
HCHP0603
CHP0805
HCHP0805
CHP1005
HCHP1005
CHP1206
HCHP1206
CHP1505
HCHP1505
CHP2010
HCHP2010
CHP1020
HCHP1020
CHP2208
HCHP2208
CHP2512
CHP2512
CHP1010
CHP1010
(1)
SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1020
2208
2512
1010
RATED POWER
Pn
W
0.050
0.125
0.125
0.200
0.250
0.250
0.500
1.000
(2)
1.000
(2)
0.750
2.000
(2)
0.500
LIMITING ELEMENT
VOLTAGE
V
50
50
50
150
150
200
200
200
200
200
250
200
MAX. OVERLOAD
VOLTAGE
V
100
100
100
300
300
400
400
400
400
400
500
400
MAX.
RESISTANCE
(1)
M
25
10
25
25
50
50
75
100
10
100
100
25
UNIT WEIGHT
mg
1
3
2
4
5
8
8
26
25
21
42
12
Notes
Shall be read in conjunction with other tables
(2)
With special assembly care
Revision: 30-May-12
Document Number: 52023
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
DIMENSIONS
in millimeters (inches)
A
D
D
C
D
A
D
C
E
E
B
CASE
SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1020
2208
2512
1010
A
VALUE
1.27 (0.050)
1.27 (0.050)
1.52 (0.060)
1.91 (0.075)
2.54 (0.100)
3.05 (0.120)
3.81 (0.150)
5.08 (0.200)
2.54 (0.100)
5.58 (0.220)
6.35 (0.250)
2.54 (0.100)
TOL.
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
0.152 (0.006)
VALUE
0.60 (0.024)
1.27 (0.050)
0.85 (0.033)
1.27 (0.050)
1.27 (0.050)
1.70(0.067)
1.32 (0.052)
2.54 (0.100)
5.08 (0.200)
2.00 (0.079)
3.30 (0.130)
2.54 (0.100)
B
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
VALUE
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
0.5 (0.020)
C
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
VALUE
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
D/E
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
SUGGESTED LAND PATTERN
(to IPC-7351A)
G
min.
X
max.
Z
max.
CASE SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1020
2208
2512
1010
DIMENSION IN MM (INCHES)
ZMAX.
1.82 (0.072)
1.82 (0.072)
2.37 (0.093)
2.76 (0.109)
3.39 (0.134)
3.90 (0.154)
4.66 (0.184)
5.93 (0.234)
3.39 (0.134)
6.43 (0.253)
7.20 (0.284)
3.39 (0.134)
GMIN.
0.10 (0.004)
0.10 (0.004)
0.35 (0.014)
0.74 (0.029)
1.37 (0.054)
1.88 (0.074)
2.64 (0.104)
3.91 (0.154)
1.37 (0.054)
4.41 (0.174)
5.18 (0.204)
1.37 (0.054)
XMAX.
0.73 (0.029)
1.40 (0.055)
0.98 (0.038)
1.40 (0.055)
1.40 (0.055)
1.73 (0.068)
1.45 (0.057)
2.67 (0.105)
5.21 (0.205)
2.04 (0.080)
3.19 (0.125)
2.67 (0.105)
Revision: 30-May-12
Document Number: 52023
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
POWER DERATING CURVE
Rated Power (%)
100
80
60
40
20
0
Vishay Sfernice
MECHANICAL SPECIFICATIONS
Substrate
Technology
Protection
Alumina
Thick film (ruthenium oxyde)
Epoxy coating
B (W/A):
SnPb over nickel barrier
for solder reflow
N (W/A):
SnAg over nickel barrier
for solder reflow
F (Flip Chip):
SnAg over nickel barrier
for solder reflow
W (one face) and G (W/A) type:
Gold over nickel barrier
for other applications
Terminations
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
Note
• Refer to Application Note “Guidelines for Vishay Sfernice
Resistive and Inductive Components” (document number:
52029) for recommended reflow profile. Profile #3 applies.
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
NUMBER OF PIECES PER PACKAGE
WAFFLE
TAPE AND REEL
PACK
MIN.
MAX.
CLIMATIC SPECIFICATIONS
Operating temperature
range
- 55 °C; + 155 °C
SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
TAPE
WIDTH
Note
• For temperature up to 215 °C please consult Vishay Sfernice
100
4000
140
100
60
100
60
60
45
1000
4000
1000
2000
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
BEST TOL. AND TCR VS. OHMIC VALUE
OHMIC VALUE
RANGE in
10
<
R
< 5M
5
<
R
< 10M
1
<
R
<
R
max.
0.1
<
R
<
R
max.
TIGHTEST
TOLERANCE
(%)
0.5 % (D)
1 % (F)
2 % (G)
5 % (J)
(1)
BEST
TCR
(ppm/°C)
100 (K)
100 (K)
200 (L)
200 (L)
Note
(1)
Improved performance on request
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
Revision: 30-May-12
Document Number: 52023
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
TYPICAL HF PERFORMANCE OF HCHP
2.0
1.8
1.6
1.4
1.2
2.0
1
Ω
10
Ω
1.8
1.6
1.4
1.2
1
Ω
10
Ω
Vishay Sfernice
|Z|/R
|Z|/R
1.0
0.8
0.6
0.4
0.2
0
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
100
Ω
200
Ω
1.0
0.8
0.6
100
Ω
1 kΩ
200
Ω
1 kΩ
0.4
0.2
0
10 000
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
10 000
Size 0603 (W/A)
f (MHz)
Size 0603 (Flip chip)
f (MHz)
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,
PRA Arrays, CHP Thick Film)
www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206/1505/1020/2010/2512).
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
Uncoated
ceramic
Enlarged
termination
C
E
B
D
A
CASE
SIZE
1206
1505
2010
1020
2208
2512
A
± 0.152
3.00
3.70
5.03
2.49
5.53
6.30
B
± 0.127
1.73
1.25
2.64
5.18
2.05
3.30
C
± 0.127
0.38
0.50
0.50
0.50
0.50
0.50
D
± 0.127
0.40
0.50
0.50
0.31
0.50
0.50
E
± 0.127
1.19
1.54
2.20
0.93
2.45
2.84
Revision: 30-May-12
Document Number: 52023
4
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
CASE SIZE
1206
1505
2010
1020
2208
2512
DIMENSIONS (IN MILLIMETERS)
Z
max.
3.85
4.55
5.88
3.34
6.38
7.15
G
min.
0.50
0.50
0.50
0.50
0.50
0.50
X
max.
1.86
1.38
2.77
5.31
2.18
3.43
OPTION: MARKING
Option to order 0013:
Marking of ohmic value and tolerance:
Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
Tolerance indicated by a color dot.
Option to order 0014:
Marking of ohmic value:
Sizes 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
No standard marking available for smaller sizes.
A price adder will apply to the unit price of the parts for options 0013 and 0014.
PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at + 260 °C
5 cycles
- 55 °C
+ 155 °C
Phase A dry heat
Phase B damp heat
Phase C cold - 55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C/85 % RH/Pn/10
1000 h
6.25 Pr
for 2 s
1000 h at rated power
90’/30’ at + 70 °C
REQUIREMENTS
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
Rapid temperature change
< ± 0.1 %
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
± (1 % + 0.05
)
± (1 % + 0.05
)
0.5 % + 0.05
± (0.25 % + 0.05
)
1000 h
± (1 % + 0.05
)
1000 h
< 0.25 %
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05
< ± 0.1 %
2000 h
< 0.5 %
10 000 h
<1%
Revision: 30-May-12
Document Number: 52023
5
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Inductive feedback oscillator circuit

Emitter coupled flip-flop circuits and applications

Current transformer multi-function protection circuit b

Touch dimmer light circuit

TDA2009 power amplifier circuit

Mileage/N consumption calculation circuit

What should I do if the number of IO pins of the microcontroller is insufficient?
When developing a project, the number of IO pins of the microcontroller is not enough. How to deal with it?Microcontrollers, as key components of general electronic product projects, are often used by...
Jacktang Microcontroller MCU
DSP GPIO Programming
Come and experience the fun of flowing lanterns directly! /******************************************************************************/ /* Copyright 2004 by SEED Electronic Technology LTD. */ /* Al...
fish001 DSP and ARM Processors
[ESP32-Audio-Kit Audio Development Board] - 2: Installing "esp-idf-v3.3.5" on Windows 10
[i=s]This post was last edited by MianQi on 2021-9-16 17:49[/i]According to the instructions here (https://docs.espressif.com/projects/esp-adf/en/latest/get-started/), "esp-adf" is an extension of "es...
MianQi RF/Wirelessly
How to realize forward and reverse pulses
Implementation methods of positive and reverse pulses1. What are the differences between open-drain output, push-pull output, and full-bridge output?2. Are drain output and open-drain OD output the sa...
QWE4562009 Analog electronics
CC2640 Software Architecture
At the highest level, the CC2640 Bluetooth software environment consists of three parts: a real-time operating system (RTOS), an application map, and a stack map. TI-RTOS is a real-time, preemptive, m...
Jacktang Wireless Connectivity
Recruiting senior analysts in the electronics industry
【Job Responsibilities】 1. Conduct in-depth research on the entire industry chain of the electronics industry, especially in the field of import substitution, and continuously provide industry analysis...
Miachaelzhangsl Talking about work
Shortcut:   S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components

  1. 530BA181M000DGR
  2. E105J3V21ME3
  3. W7NCF08GH20CSA3EM1G
  4. 530MC55M0000DG
  5. CL21L120JCNB
  6. SP450M6R80AZS71320
  7. 7107SH3W5GES
  8. VC-707-EDE-SAAN-322M2656000
  9. SC2128A-L30S
  10. A2541WR-19P
  11. D3961WVD-10P-G15
  12. C3961HM-3P

Popular Articles

  1. s3c2440 learning path-008 uart implements printf function
  2. NIO releases 75kWh ternary iron-lithium battery pack, reducing low-temperature endurance loss by 25%
  3. Intel plans to spend 80 billion euros to build factories in Europe over ten years
  4. Design of eight-way buzzer-beater based on 51 single-chip microcomputer
  5. SK Hynix: Industry's first 24GB DDR5 memory sample
  6. The ingenious design of Tube-11 double-tube vibrating rod level switch
  7. Ming-Chi Kuo predicts Apple's second-generation AirPods Pro will have a new look, lossless audio
  8. 6 common problems when using spectrum analyzers
  9. Infineon launches new generation MOTIX™ half-bridge driver IC
  10. Who is to blame if the oscilloscope cannot catch low-probability abnormal signals?

Technical ResourceMore

  1. Design of environmental temperature and humidity monitoring system based on GPRS
  2. VC-like program code with 2 bars
  3. Excellent mold design conditions
  4. LED dot matrix display circuit diagram
  5. Introduction to Linux device drivers
  6. Forward high frequency transformer design formula
  7. LED fluorescent lamp design scheme
  8. ZTE ZXJ10 Highlights 2000
  9. Conquering Excel VBA
  10. Analysis and maintenance of common faults of switching power supply

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号