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W24258Q-70LE

Description
32k X 8 cmos static ram
Categorystorage    storage   
File Size198KB,11 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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W24258Q-70LE Overview

32k X 8 cmos static ram

W24258Q-70LE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeTSOP
package instruction8 X 13.40 MM, TSOP1-28
Contacts28
Reach Compliance Code_compli
ECCN codeEAR99
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length11.8 mm
memory density262144 bi
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
organize32KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP28,.53,22
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000002 A
Minimum standby current2 V
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.55 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width8 mm

W24258Q-70LE Related Products

W24258Q-70LE W24258-70LI W24258H W24258Q-70LI W24258 W24258-70LE W24258S-70LE W24258S-70LI
Description 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram
Is it Rohs certified? incompatible incompatible - incompatible - incompatible incompatible incompatible
Maker Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code TSOP DIP DIE TSOP - DIP SOIC SOIC
package instruction 8 X 13.40 MM, TSOP1-28 0.600 INCH, PLASTIC, DIP-28 DIE, 8 X 13.40 MM, TSOP1-28 - 0.600 INCH, PLASTIC, DIP-28 0.330 INCH, SOP-28 0.330 INCH, SOP-28
Contacts 28 28 28 28 - 28 28 28
Reach Compliance Code _compli _compli unknow _compli - _compli _compli _compli
ECCN code EAR99 EAR99 EAR99 EAR99 - EAR99 EAR99 EAR99
Maximum access time 100 ns 100 ns 100 ns 100 ns - 100 ns 100 ns 100 ns
I/O type COMMON COMMON - COMMON - COMMON COMMON COMMON
JESD-30 code R-PDSO-G28 R-PDIP-T28 R-XUUC-N28 R-PDSO-G28 - R-PDIP-T28 R-PDSO-G28 R-PDSO-G28
JESD-609 code e0 e0 - e0 - e0 e0 e0
length 11.8 mm 37.08 mm - 11.8 mm - 37.08 mm 18.11 mm 18.11 mm
memory density 262144 bi 262144 bi 262144 bi 262144 bi - 262144 bi 262144 bi 262144 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 - 8 8 8
Number of functions 1 1 1 1 - 1 1 1
Number of terminals 28 28 28 28 - 28 28 28
word count 32768 words 32768 words 32768 words 32768 words - 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 - 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 85 °C - 85 °C 85 °C 85 °C
Minimum operating temperature -20 °C -40 °C - -40 °C - -20 °C -20 °C -40 °C
organize 32KX8 32KX8 32KX8 32KX8 - 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE - 3-STATE - 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 DIP DIE TSOP1 - DIP SOP SOP
Encapsulate equivalent code TSSOP28,.53,22 DIP28,.6 - TSSOP28,.53,22 - DIP28,.6 SOP28,.5 SOP28,.5
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE IN-LINE UNCASED CHIP SMALL OUTLINE, THIN PROFILE - IN-LINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3/5 V 3/5 V - 3/5 V - 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 5.33 mm - 1.2 mm - 5.33 mm 2.85 mm 2.85 mm
Maximum standby current 0.000002 A 0.000002 A - 0.000002 A - - 0.000002 A 0.000002 A
Minimum standby current 2 V 2 V - 2 V - 2 V 2 V 2 V
Maximum slew rate 0.07 mA 0.07 mA - 0.07 mA - 0.07 mA 0.07 mA 0.07 mA
Maximum supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V - 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V - 3 V 3 V 3 V
surface mount YES NO YES YES - NO YES YES
technology CMOS CMOS CMOS CMOS - CMOS CMOS CMOS
Temperature level OTHER INDUSTRIAL COMMERCIAL INDUSTRIAL - OTHER OTHER INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE NO LEAD GULL WING - THROUGH-HOLE GULL WING GULL WING
Terminal pitch 0.55 mm 2.54 mm - 0.55 mm - 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL UPPER DUAL - DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8 mm 15.24 mm - 8 mm - 15.24 mm 8.41 mm 8.41 mm

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