W24258H datasheet, PDF - EEWORLD Datasheet

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W24258H: Description32k X 8 cmos static ram; Categorystorage storage; File Size198KB，11 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W24258H Overview

32k X 8 cmos static ram

W24258H Parametric

Parameter Name	Attribute value
Maker	Winbond Electronics Corporation
Parts packaging code	DIE
package instruction	DIE,
Contacts	28
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	100 ns
JESD-30 code	R-XUUC-N28
memory density	262144 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER

W24258H Related Products

	W24258H	W24258-70LI	W24258Q-70LI	W24258	W24258-70LE	W24258Q-70LE	W24258S-70LE	W24258S-70LI
Description	32k X 8 cmos static ram	32k X 8 cmos static ram	32k X 8 cmos static ram	32k X 8 cmos static ram	32k X 8 cmos static ram	32k X 8 cmos static ram	32k X 8 cmos static ram	32k X 8 cmos static ram
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	DIE	DIP	TSOP	-	DIP	TSOP	SOIC	SOIC
package instruction	DIE,	0.600 INCH, PLASTIC, DIP-28	8 X 13.40 MM, TSOP1-28	-	0.600 INCH, PLASTIC, DIP-28	8 X 13.40 MM, TSOP1-28	0.330 INCH, SOP-28	0.330 INCH, SOP-28
Contacts	28	28	28	-	28	28	28	28
Reach Compliance Code	unknow	_compli	_compli	-	_compli	_compli	_compli	_compli
ECCN code	EAR99	EAR99	EAR99	-	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	100 ns	100 ns	-	100 ns	100 ns	100 ns	100 ns
JESD-30 code	R-XUUC-N28	R-PDIP-T28	R-PDSO-G28	-	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28
memory density	262144 bi	262144 bi	262144 bi	-	262144 bi	262144 bi	262144 bi	262144 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	-	8	8	8	8
Number of functions	1	1	1	-	1	1	1	1
Number of terminals	28	28	28	-	28	28	28	28
word count	32768 words	32768 words	32768 words	-	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	-	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-	-20 °C	-20 °C	-20 °C	-40 °C
organize	32KX8	32KX8	32KX8	-	32KX8	32KX8	32KX8	32KX8
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIE	DIP	TSOP1	-	DIP	TSOP1	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	IN-LINE	SMALL OUTLINE, THIN PROFILE	-	IN-LINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	-	3 V	3 V	3 V	3 V
surface mount	YES	NO	YES	-	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	-	OTHER	OTHER	OTHER	INDUSTRIAL
Terminal form	NO LEAD	THROUGH-HOLE	GULL WING	-	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal location	UPPER	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL
Is it Rohs certified?	-	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible
I/O type	-	COMMON	COMMON	-	COMMON	COMMON	COMMON	COMMON
JESD-609 code	-	e0	e0	-	e0	e0	e0	e0
length	-	37.08 mm	11.8 mm	-	37.08 mm	11.8 mm	18.11 mm	18.11 mm
Output characteristics	-	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Encapsulate equivalent code	-	DIP28,.6	TSSOP28,.53,22	-	DIP28,.6	TSSOP28,.53,22	SOP28,.5	SOP28,.5
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED
power supply	-	3/5 V	3/5 V	-	3/5 V	3/5 V	3/5 V	3/5 V
Maximum seat height	-	5.33 mm	1.2 mm	-	5.33 mm	1.2 mm	2.85 mm	2.85 mm
Maximum standby current	-	0.000002 A	0.000002 A	-	-	0.000002 A	0.000002 A	0.000002 A
Minimum standby current	-	2 V	2 V	-	2 V	2 V	2 V	2 V
Maximum slew rate	-	0.07 mA	0.07 mA	-	0.07 mA	0.07 mA	0.07 mA	0.07 mA
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	-	2.54 mm	0.55 mm	-	2.54 mm	0.55 mm	1.27 mm	1.27 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED
width	-	15.24 mm	8 mm	-	15.24 mm	8 mm	8.41 mm	8.41 mm

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